Transformation of 2D Planes into 3D Soft and Flexible Structures with Embedded Electrical Functionality

Three-dimensional (3D) structures composed of flexible and soft materials have been in demand for implantable biomedical devices. However, the fabrication of 3D structures using microelectromechanical system (MEMS) techniques has limitations in terms of the materials and the scale of the structures. Here, a technique to selectively bond polydimethylsiloxane (PDMS) and parylene-C by plasma treatment is reported, with which two-dimensional structures that are fabricated using MEMS techniques are turned into 3D structures by the inflation of selectively non-bonded patterns. The bonding strength and the bonding mechanism were analyzed by mechanical tests and chemical analyses, respectively. We fabricated soft and flexible 3D structures with various patterns and dimensions, even with embedded electrical functions, including light emitting diodes and electrocorticogram electrodes. Based on these results, the flexible, soft, and MEMS-capable 3D structures that are obtained by the developed selective bonding technique are promising for applications in a wide range of biomedical applications.