Three-Dimensionally Printed Micro-electromechanical Switches
Source abstract
Abstract
Three-dimensional (3D) printers have attracted considerable attention from both industry and academia and especially in recent years because of their ability to overcome the limitations of two-dimensional (2D) processes and to enable large-scale facile integration techniques. With 3D printing technologies, complex structures can be created using only a computer-aided design file as a reference; consequently, complex shapes can be manufactured in a single step with little dependence on manufacturer technologies. In this work, we provide a first demonstration of the facile and time-saving 3D printing of two-terminal micro-electromechanical (MEM) switches. Two widely used thermoplastic materials were used to form 3D-printed MEM switches; freely suspended and fixed electrodes were printed from conductive polylactic acid, and a water-soluble sacrificial layer for air-gap formation was printed from poly(vinyl alcohol). Our 3D-printed MEM switches exhibit excellent electromechanical properties, with abrupt switching characteristics and an excellent on/off current ratio value exceeding 106. Therefore, we believe that our study makes an innovative contribution with implications for the development of a broader range of 3D printer applications (e.g., the manufacturing of various MEM devices and sensors), and the work highlights a uniquely attractive path toward the realization of 3D-printed electronics.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced MEMS and NEMS Technologies · Advanced Sensor and Energy Harvesting Materials · Mechanical and Optical Resonators
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Electrical Engineering, Kookmin University, Seoul 02707, Korea
Mechatronics R&D Center, Samsung Electronics, Hwaseong, Gyeonggi-do 18448, Korea
Department of Nano-process, National Nanofab Center (NNFC), Daejeon 34141, Korea
Department of Electrical Engineering, Sejong University, Seoul 05006, Korea
Funding
National Research Foundation of Korea · Korea Evaluation Institute of Industrial Technology · Korea Semiconductor Research Consortium
References (42)
Show source-provided references
1. 10.1021/acs.molpharmaceut.5b0051010.1021/acs.molpharmaceut.5b00510 ↗
2. 10.1002/adma.20150621510.1002/adma.201506215 ↗
3. 10.1021/ac403397r10.1021/ac403397r ↗
4. 10.1371/journal.pone.004936510.1371/journal.pone.0049365 ↗
5. 10.1126/science.122634010.1126/science.1226340 ↗
6. 10.1007/s00170-014-5717-710.1007/s00170-014-5717-7 ↗
7. 10.3357/ASEM.3898.201410.3357/ASEM.3898.2014 ↗
8. 10.1002/smll.20150352410.1002/smll.201503524 ↗
9. 10.1002/adma.20130140010.1002/adma.201301400 ↗
10. 10.1002/jbm.b.3029110.1002/jbm.b.30291 ↗
11. 10.1002/adfm.20170065510.1002/adfm.201700655 ↗
12. 10.1038/srep1920710.1038/srep19207 ↗
13. 10.1016/S0142-9612(02)00276-410.1016/S0142-9612(02)00276-4 ↗
14. 10.1088/0964-1726/24/12/12502110.1088/0964-1726/24/12/125021 ↗
15. 10.1016/S0928-4931(02)00012-710.1016/S0928-4931(02)00012-7 ↗
16. 10.1021/nl503329210.1021/nl5033292 ↗
17. 10.1002/adma.20150539110.1002/adma.201505391 ↗
18. 10.1038/518042a10.1038/518042a ↗
19. 10.1002/adma.20160348610.1002/adma.201603486 ↗
20. 10.1109/IEDM.2005.160938410.1109/IEDM.2005.1609384 ↗
21. 10.1109/VLSIC.2004.134648710.1109/VLSIC.2004.1346487 ↗
22. 10.1038/nmat190310.1038/nmat1903 ↗
23. 10.1109/TED.2010.209987010.1109/TED.2010.2099870 ↗
24. 10.1109/IEDM.2016.783848910.1109/IEDM.2016.7838489 ↗
25. 10.1109/22.73450110.1109/22.734501 ↗
26. Rebeiz G. M. · Proc. 12th Int. Conf. Transducers, Solid-State Sens. Actuators Microsyst. · 2003 · 2 · 172610.1109/SENSOR.2003.1217118 ↗
27. 10.1002/tee.2013910.1002/tee.20139 ↗
28. 10.1021/acs.nanolett.5b0047710.1021/acs.nanolett.5b00477 ↗
29. 10.1109/IEDM.2011.613163610.1109/IEDM.2011.6131636 ↗
30. 10.1021/nl402863210.1021/nl4028632 ↗
31. 10.1016/j.msec.2015.06.00210.1016/j.msec.2015.06.002 ↗
32. 10.1063/1.488576110.1063/1.4885761 ↗
33. 10.1016/j.ijpharm.2015.04.06910.1016/j.ijpharm.2015.04.069 ↗
34. 10.1016/j.ijpharm.2014.09.04410.1016/j.ijpharm.2014.09.044 ↗
35. 10.2478/amm-2013-018610.2478/amm-2013-0186 ↗
36. 10.1016/j.colsurfb.2012.10.01610.1016/j.colsurfb.2012.10.016 ↗
37. 10.1109/6668.96993610.1109/6668.969936 ↗
38. Rebeiz, G. M.RF MEMS Theory, Design, and Technology; John Wiley & Sons, Inc.: Hoboken, NJ, 2003; Chapter 2, pp 36–38.10.1002/0471225282 ↗
39. Saha, S. C.; Hanke, U.; Jensen, G. U.; Sæther, T. Modeling of Spring Constant and Pull-down Voltage of Non Uniform RF MEMS Cantilever. InIEEE Proceedings of Behavioral Modeling and Simulation Workshop; IEEE: New York, 2006; pp 56–60.10.1109/BMAS.2006.283470 ↗
40. 10.1186/s41205-017-0023-210.1186/s41205-017-0023-2 ↗
41. McGruer, N. E.; Adams, G. G.; Chen, L.; Guo, Z. J.; Du, Y. Mechanical, Thermal, and Material Influences on Ohmic-Contact-Type MEMS Switch Operation. InIEEE 19th International Microelectromechanical Systems Conference; IEEE: New York, 2006; pp 230–233.10.1109/MEMSYS.2006.1627778 ↗
42. 10.1038/micronano.2016.1010.1038/micronano.2016.10 ↗