Effect of Thermal Annealing on the Electrical Conductivity of Copper–Tin Polymer Composites
Source abstract
Abstract
Polyvinylidene fluoride (PVDF) copolymer conductive composites containing 40 vol % copper (Cu) and tin (Sn) fillers are prepared by injection molding. Postmolding thermal annealing is found to increase the electrical conductivity of the composites by an order of magnitude. The volume ratio between Cu and Sn is found to have a significant effect on filler distribution but a weaker effect on electrical conductivity compared to the annealing conditions. Synchrotron X-ray tomography is used to visualize and quantitatively analyze the morphology and distribution of the filler particles, indicating that higher conductivity can be attributed to better dispersion of the low-melting-point Sn filler, which provides better interparticle contact in the Cu network.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Advanced Light Source, Lawrence Berkeley National Laboratory, Berkeley, California 94720, United States
Tyco Electronics Corporation, TE Connectivity Ltd., Menlo Park, California 94025, United States
Funding
TE Connectivity Ltd.
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