Ag/Fe₃O₄-Catalyzed Fabrication of Flexible Printed Circuits: Integrated UV-Curing and Electroless Plating Process

The development of a highly adaptable and efficient method for the rapid design and fabrication of durable flexible circuit boards on various substrates, especially heat-sensitive ones, holds great significance for sensors and actuators. Herein, we fabricated a development of high-performance flexible circuits by integrating ultraviolet (UV) curing and electroless plating technologies, utilizing a photocurable layer of the Ag/Fe 3 O 4 catalyst deposited onto a thin-film substrate designed for heat-resistant applications. The microstructure, stability, and durability of the fabricated flexible printed circuits (FPCs) were comprehensively characterized. The results indicate that the FPCs exhibit superior electrical conductivity and exceptional mechanical durability. Specifically, after 10,000 bending cycles, the resistance variation remained below 9.0%, while after 5000 friction cycles, the resistance change was merely 14.6%. Additionally, the FPCs displayed remarkable thermal stability, with a resistance change of less than 5.4% across a broad temperature range from −25 to 65 °C. This work presents a scalable, efficient, and repairable fabrication strategy for conductive layers under mild conditions, eliminating the need for high-temperature sintering equipment and offering a cost-effective and sustainable solution for FPC production.