Straightforward Manufacturing of 3D-Printed Metallic Structures toward Customized Electrical Components

Metalizing three-dimensional (3D)-printed polymers has been spotlighted in the field of manufacturing high-end and customized electrical components. Conventional metalization approaches that rely on the electroless plating (ELP) process typically require the use of noble metal-based catalysts or involve multistep processes, limiting their practical applications. Herein, we propose a straightforward yet effective approach to manufacture 3D-printed polymers with conductive metal layers through a thiol-mediated ELP process without involving an additional catalytic activation process. A photocurable ternary resin based on thiol-ene-acrylate monomers was precisely designed to induce excess thiol moieties on the surface of 3D-printed structures. These exposed thiol moieties served as active sites for metal ion complexion via strong metal-sulfur bonds, allowing the deposition of metal layers on the 3D-printed polymers through the ELP. Diverse metal layers, including Cu, Ag, and NiP, could be deposited onto virtually any 3D-printed structures with high uniformity and adhesion stability. To highlight the potential application of our approach, we fabricated fully functional glucose sensors through the deposition of the Cu layer on 3D-printed electrode models, and these sensors displayed excellent nonenzymatic glucose sensing performance. The proposed approach offers great insights for designing functional metallic structures and opens up new avenues for manufacturing lightweight, customized electrical components.