Effective Utilization of STEM Imaging Capability in FIB for Physical Failure Analysis on 20nm & 14nm Transistor Nodes in Semiconductor Wafer Foundries
Source abstract
Abstract
Extended abstract of a paper presented at Microscopy and Microanalysis 2013 in Indianapolis, Indiana, USA, August 4 – August 8, 2013.
Only a short abstract or summary was supplied by the source.
Source: crossref · Quality: short
Research context
OpenAlex topics: Integrated Circuits and Semiconductor Failure Analysis · Advanced Electron Microscopy Techniques and Applications · Electron and X-Ray Spectroscopy Techniques
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References
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