Show source-provided references
15. Didier, C. M.; Fox, D.; Baksh, A.; Pollard, K.; Iyer, N.; Bosak, A.; Orrico, J.; Castro, J. M.; Kundu, A.; Zhai, L.; Ashton, R. S.; Moore, M. J.; Rajaraman, S. Stable, Electron-Beam Sublimated, Nanostructured Silicon Dioxide On Polycarbonate And Stainless-Steel As A Bioadherent Dielectric Towards Neural Microphysiological Systems. InHilton Head 2022 MEMS WorkshopHilton Head, SC;2022.
10.31438/trf.hh2022.62 ↗31. Didier, C. M.; Rountree, C.; Orrico, J. F.; Kundu, A.; Azim, N.; Nguyen, H.; Pasha, S. K.; McCoy, L.; Curley, J. L.; Moore, M. J.; Rajaraman, S. Fabrication and Characterization of 3D Microelectrode Arrays (3D MEAs) with ″Edge-Wrapped″ Metal Interconnects and 3D-Printed Assembly Rigs for Simultaneous Optical and Electrical Probing of Nerve-on-a-Chip Constructs. In2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS)2021; pp 226–229.
10.1109/MEMS51782.2021.9375313 ↗43. Omnexus. Glass Transition Temperature. In Omnexus Special Chemistry; 2022 https://omnexus.specialchem.com/polymer-properties/properties/glass-transition-temperature.
48. Orrico, J. F.; Kundu, A.; Didier, C. M.; Bosak, A.; Moore, M. J.; Rajaraman, S. Fabrication and Characterization of 3D Microelectrode Arrays (3D MEAS) with Tri-Modal (Electrical, Optical, and Microfluidic) Interrogation of Electrogenic Cell Constructs. In2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), 2021; pp 767–770.
10.1109/Transducers50396.2021.9495378 ↗51. Bondarenko, A. S.; Ragoisha, G. A. EIS Spectrum Analyser - Equivalent Circuit Elements and Parameters, 2008.
53. Castro, J. M.; Rajaraman, S. Constant Phase Element (CPE) Modeling And Analysis Of Multi-Material, Micro-Bullet Shaped, High-Throughput 3D Microelectrodes For In-VIitro Electrophysiological Applications. InProceedings of the 2022 Hilton Head MEMS Workshop 2022.
71. Borkholder D. · 1998
72. Rajaraman S. · 2009
73. Didier, C. M.; Kundu, A.; Rajaraman, S.Facile, Packaging Substrate-Agnostic, Microfabrication and Assembly of Scalable 3D Metal Microelectrode Arrays for in Vitro Organ-on-a-Chip and Cellular Disease Modeling. In20th International Conference on Solid-State Sensors, Actuators and Microsystems & Eurosensors XXXIII (TRANSDUCERS & EUROSENSORS XXXIII)2019; pp 1686–1689.
10.1109/TRANSDUCERS.2019.8808364 ↗