journal article·2021-12-22

Deep Well Trapping of Hot Carriers in a Hexagonal Boron Nitride Coating of Polymer Dielectrics

Thomas Linker, Yifei Wang, Ankit Mishra, Deepak Kamal, Yang Cao, Rajiv K. Kalia, Aiichiro Nakano, Rampi Ramprasad, Fuyuki Shimojo, Gregory Sotzing, Priya Vashishta

ACS Applied Materials & Interfaces· Volume 13· Issue 50
Publisher page

Abstract

Polymer dielectrics can be cost-effective alternatives to conventional inorganic dielectric materials, but their practical application is critically hindered by their breakdown under high electric fields driven by excited hot charge carriers. Using a joint experiment-simulation approach, we show that a 2D nanocoating of hexagonal boron nitride (hBN) mitigates the damage done by hot carriers, thereby increasing the breakdown strength. Surface potential decay and dielectric breakdown measurements of hBN-coated Kapton show the carrier-trapping effect in the hBN nanocoating, which leads to an increased breakdown strength. Nonadiabatic quantum molecular dynamics simulations demonstrate that hBN layers at the polymer-electrode interfaces can trap hot carriers, elucidating the observed increase in the breakdown field. The trapping of hot carriers is due to a deep potential well formed in the hBN layers at the polymer-electrode interface. Searching for materials with similar deep well potential profiles could lead to a computationally efficient way to design good polymer coatings that can mitigate breakdown.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Semiconductor materials and devices · Ferroelectric and Piezoelectric Materials · Electronic and Structural Properties of Oxides

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Collaboratory for Advanced Computing and Simulations, University of Southern California, Los Angeles, California 90089-0242, United States

Electrical Insulation Research Center, Institute of Materials Science, University of Connecticut, Storrs, Connecticut 06269, United States

School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States

Department of Physics, Kumamoto University, Kumamoto 860-8555, Japan

Institute of Materials Science, University of Connecticut, Storrs, Connecticut 06269, United States

Funding

Office of Naval Research Global

References (52)

Show source-provided references
1. 10.1126/science.112779810.1126/science.1127798 ↗
2. 10.1038/s41467-018-04665-z10.1038/s41467-018-04665-z ↗
3. 10.1038/ncomms584510.1038/ncomms5845 ↗
4. 10.1109/TDEI.2005.152218910.1109/TDEI.2005.1522189 ↗
5. 10.1109/TEI.1980.29831410.1109/TEI.1980.298314 ↗
6. 10.1103/PhysRevB.70.06410110.1103/PhysRevB.70.064101 ↗
7. 10.1038/nature1464710.1038/nature14647 ↗
8. 10.1038/s41467-019-09874-810.1038/s41467-019-09874-8 ↗
9. 10.1098/rspa.1934.011610.1098/rspa.1934.0116 ↗
10. 10.1098/rspa.1937.010610.1098/rspa.1937.0106 ↗
11. 10.1063/1.171025810.1063/1.1710258 ↗
12. 10.1103/PhysRevB.24.351910.1103/PhysRevB.24.3519 ↗
13. 10.1063/1.475584110.1063/1.4755841 ↗
14. 10.1109/MEI.2013.645759510.1109/MEI.2013.6457595 ↗
15. 10.1021/nn506645q10.1021/nn506645q ↗
16. 10.1002/adma.20170186410.1002/adma.201701864 ↗
17. 10.1021/acsami.5b0509210.1021/acsami.5b05092 ↗
18. 10.1109/TDEI.2020.00859210.1109/TDEI.2020.008592 ↗
19. 10.1021/acs.jpclett.9b0134410.1021/acs.jpclett.9b01344 ↗
20. 10.1021/acs.jpclett.9b0314710.1021/acs.jpclett.9b03147 ↗
21. 10.1038/sdata.2016.1210.1038/sdata.2016.12 ↗
22. 10.1021/acs.chemmater.7b0202710.1021/acs.chemmater.7b02027 ↗
23. 10.1109/TDEI.2017.00687210.1109/TDEI.2017.006872 ↗
24. 10.1063/1.479249110.1063/1.4792491 ↗
25. 10.1109/TDEI.2016.00581110.1109/TDEI.2016.005811 ↗
26. 10.1063/1.509356610.1063/1.5093566 ↗
27. 10.1063/1.166747110.1063/1.1667471 ↗
28. 10.1007/s10853-015-9369-210.1007/s10853-015-9369-2 ↗
29. Chen, L.; Huan, T. D.; Huzayyin, A.; Quintero, Y. C.; Ramprasad, R. First-Principles Study of Aluminum-Polyethylene Interfaces. In2014 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), 2014; pp. 887–890.10.1109/CEIDP.2014.6995833 ↗
30. 10.1063/1.508986310.1063/1.5089863 ↗
31. 10.1103/PhysRev.140.A113310.1103/PhysRev.140.A1133 ↗
32. 10.1103/PhysRevLett.55.247110.1103/PhysRevLett.55.2471 ↗
33. 10.1103/RevModPhys.64.104510.1103/RevModPhys.64.1045 ↗
34. 10.1103/PhysRevLett.77.386510.1103/PhysRevLett.77.3865 ↗
35. 10.1103/PhysRevB.50.1795310.1103/PhysRevB.50.17953 ↗
36. 10.1016/0009-2614(72)85104-210.1016/0009-2614(72)85104-2 ↗
37. 10.1103/PhysRevB.90.15540510.1103/PhysRevB.90.155405 ↗
38. 10.1063/1.472180910.1063/1.4721809 ↗
39. 10.1063/1.174058810.1063/1.1740588 ↗
40. 10.1021/acsami.1c1285410.1021/acsami.1c12854 ↗
41. 10.1002/jcc.2049510.1002/jcc.20495 ↗
42. 10.1063/1.240466310.1063/1.2404663 ↗
43. 10.1103/PhysRevB.52.R546710.1103/PhysRevB.52.R5467 ↗
44. 10.1103/PhysRevB.75.23510210.1103/PhysRevB.75.235102 ↗
45. 10.1103/PhysRevB.74.03510110.1103/PhysRevB.74.035101 ↗
46. 10.1016/j.softx.2019.10030710.1016/j.softx.2019.100307 ↗
47. 10.1016/j.cpc.2012.08.00110.1016/j.cpc.2012.08.001 ↗
48. 10.1063/1.296062810.1063/1.2960628 ↗
49. 10.1063/1.486934210.1063/1.4869342 ↗
50. 10.1103/PhysRevLett.52.99710.1103/PhysRevLett.52.997 ↗
51. 10.1063/1.45917010.1063/1.459170 ↗
52. 10.1103/PhysRevLett.95.16300110.1103/PhysRevLett.95.163001 ↗