12″ Wafer-Scale Mass-Manufactured Metal–Insulator–Metal Reflective Metaholograms by Nanotransfer Printing

The unique characteristics of metasurfaces to precisely control the amplitude, phase, and polarization of light within a thin, flat footprint make them a promising replacement for bulky optical components. However, fabrication methods of conventional metasurfaces have suffered from low throughput and high costs, limiting scalability and practical application. To address these challenges, an advanced fabrication technique is developed by combining deep-ultraviolet argon fluoride photolithography with wafer-scale nanotransfer printing to facilitate the scalable fabrication of metal-insulator-metal structures. This approach not only facilitates the production of numerous reflective metaholograms with a yield of 70.6% on 8 inch wafers but also significantly reduces production costs to under one dollar per unit, improving economic feasibility. Hundreds of metaholograms each on the millimeter scale have been fabricated and operate across the visible to near-infrared range, showing conversion efficiencies of 43.6% at 635 nm, 40% at 940 nm, and 2.2% at 532 nm. This result opens new avenues for the widespread adoption of metasurface technologies in imaging, sensing, and optical communications. By enabling scalable, cost-effective production, our method is poised for widespread adoption and opening new possibilities in metasurface technology.