journal article·2024-04-17Open access

Solution-Processed Flexible Temperature Sensor Array for Highly Resolved Spatial Temperature and Tactile Mapping Using ESN-Based Data Interpolation

Haruki Nakamura, Ryota Ezaki, Guren Matsumura, Chia-Chen Chung, Yu-Chieh Hsu, Yu-Ren Peng, Akito Fukui, Yu-Lun Chueh, Daisuke Kiriya, Kuniharu Takei

ACS Applied Materials & Interfaces· Volume 16· Issue 15

Abstract

High-performance flexible temperature sensors are crucial in various technological applications, such as monitoring environmental conditions and human healthcare. The ideal characteristics of these sensors for stable temperature monitoring include scalability, mechanical flexibility, and high sensitivity. Moreover, simplicity and low power consumption will be essential for temperature sensor arrays in future integrated systems. This study introduces a solution-based approach for creating a V 2 O 5 nanowire network temperature sensor on a flexible film. Through optimization of the fabrication conditions, the sensor exhibits remarkable performance, sustaining long-term stability (>110 h) with minimal hysteresis and excellent sensitivity (∼−1.5%/°C). In addition, this study employs machine learning techniques for data interpolation among sensors, thereby enhancing the spatial resolution of temperature measurements and adding tactile mapping without increasing the sensor count. Introducing this methodology results in an improved understanding of temperature variations, advancing the capabilities of flexible-sensor arrays for various applications.
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Research context

OpenAlex topics: Advanced Chemical Sensor Technologies · Advanced Sensor and Energy Harvesting Materials · Gas Sensing Nanomaterials and Sensors

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Graduate School of Information Science and Technology, Hokkaido University, Sapporo 060-0814, Japan

Department of Physics and Electronics, Osaka Metropolitan University, Sakai 599-8531, Japan

Department of Materials Science and Engineering, National Tsing-Hua University, Hsinchu 30013, Taiwan

College of Semiconductor Research, National Tsing-Hua University, Hsinchu 30013, Taiwan

Department of Materials Science and Engineering, Korea University, Seoul 02841, Republic of Korea

Graduate School of Arts and Sciences, The University of Tokyo, Tokyo 153-8902, Japan

Funding

Takeda Science Foundation · Murata Science Foundation · AIP Network Laboratory · Japan Society for the Promotion of Science · Advanced Low Carbon Technology Research and Development Program · Hitachi Global Foundation

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