journal article·2021-09-15Open access

Bottom-Up Nanofabrication with Extreme-Ultraviolet Light: Metal–Organic Frameworks on Patterned Monolayers

O. Lugier, N. Thakur, L. Wu, M. Vockenhuber, Y. Ekinci, S. Castellanos

ACS Applied Materials & Interfaces· Volume 13· Issue 36

Abstract

The fabrication of integrated circuits with ever smaller (sub-10 nm) features poses fundamental challenges in chemistry and materials science. As smaller nanostructures are fabricated, thinner layers of materials are required, and surfaces and interfaces gain a more important role in the formation of nanopatterns. We present a new bottom-up approach in which we use the high optical resolution offered by extreme ultraviolet (EUV) lithography to print patterns on self-assembled monolayers (SAMs). Upon radiation, low-energy electrons induce chemical changes in the SAM so that the projected image is transferred to the substrate surface. We use the chemical differences between exposed and unexposed regions to promote a selective growth of hybrid structures that can act as an etch-resistant layer for further pattern transfer or can be used as functional nanostructures. The EUV doses required to promote selective growth on exposed areas are close to industrial requirements. Furthermore, this method allows for the independent tuning of different steps in the EUV lithography process (photo-induced chemistry, spatially resolved chemical contrast, and formation of nanopatterns), an advantage over current resists, in which the same material plays all roles.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advancements in Photolithography Techniques · Semiconductor materials and devices · Nanofabrication and Lithography Techniques

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Advanced Research Center for Nanolithography, Science Park 106, 1098XG Amsterdam, The Netherlands

Paul Scherrer Institute, Forschungstrasse 111, 5232 Villigen, Switzerland

Funding

H2020 Research Infrastructures

References (47)

Show source-provided references
1. Moore, G. Cramming More Components onto Integrated Circuits, Reprinted from Electronics; IEEE, 1965; Vol. 38.
2. IEEE International Roadmap for Devices and SystemsTM. https://irds.ieee.org, (accessed Jan 2, 2020).
3. 10.2494/photopolymer.30.11310.2494/photopolymer.30.113 ↗
4. 10.2494/photopolymer.30.59910.2494/photopolymer.30.599 ↗
5. Xu, H.; Kosma, V.; Giannelis, E.; Ober, C. K.; Sakai, K. EUV Photolithography: Resist Progress and Challenges. In Extreme Ultraviolet (EUV) Lithography IX; Proceedings of SPIE, 2018; p 2.10.1117/12.2302759 ↗
6. Levinson, H. J.; Brunner, T. A. Current Challenges and Opportunities for EUV Lithography. In International Conference on Extreme Ultraviolet Lithography 2018; Proceedings of SPIE, 2018; p 2.10.1117/12.2502791 ↗
7. 10.1039/c7cs00080d10.1039/c7cs00080d ↗
8. Fallica, R.; Rezvani, S. J.; Nannarone, S.; Borisov, S.; De Simone, D.; Babin, S.; Lorusso, G.; Vandenberghe, G. The Hidden Energy Tail of Low Energy Electrons in EUV Lithography. In Advances in Patterning Materials and Processes XXXVI; Proceedings of SPIE, 2019; p 8.10.1117/12.2514998 ↗
9. 10.1002/adma.20150117110.1002/adma.201501171 ↗
10. Bilski, B.; Zimmermann, J.; Roesch, M.; Liddle, J.; van Setten, E.; Bottiglieri, G.; van Schoot, J. High-NA EUV Imaging: Challenges and Outlook. In 35th European Mask and Lithography Conference (EMLC 2019); Behringer, U. F., Finders, J., Eds. SPIE, 2019; p 42.10.1117/12.2536329 ↗
11. Zahlten, C.; Gräupner, P.; van Schoot, J.; Kuerz, P.; Stoeldraijer, J.; Kaiser, W. High-NA EUV Lithography: Pushing the Limits. In 35th European Mask and Lithography Conference (EMLC 2019); Behringer, U. F., Finders, J., Eds. SPIE, 2019; p 43.10.1117/12.2536469 ↗
12. 10.1006/adnd.1993.101310.1006/adnd.1993.1013 ↗
13. 10.1039/a910314g10.1039/a910314g ↗
14. 10.1021/la991034r10.1021/la991034r ↗
15. 10.1063/1.12637810.1063/1.126378 ↗
16. 10.1021/acs.jpcc.6b1126910.1021/acs.jpcc.6b11269 ↗
17. 10.1016/j.progsurf.2003.12.00110.1016/j.progsurf.2003.12.001 ↗
18. 10.1088/0957-4484/27/39/39530110.1088/0957-4484/27/39/395301 ↗
19. 10.1039/c7tc01015j10.1039/c7tc01015j ↗
20. 10.1038/s41598-018-35195-910.1038/s41598-018-35195-9 ↗
21. 10.1021/la301042y10.1021/la301042y ↗
22. 10.1186/s11671-017-2056-210.1186/s11671-017-2056-2 ↗
23. 10.1088/0957-4484/23/23/23530210.1088/0957-4484/23/23/235302 ↗
24. 10.1016/j.ccr.2015.09.01310.1016/j.ccr.2015.09.013 ↗
25. 10.1063/1.494533010.1063/1.4945330 ↗
26. 10.1021/acs.chemmater.9b0315510.1021/acs.chemmater.9b03155 ↗
27. Castellanos, S.; Verhoeven, J.; Frenken, J.; Antonov, P.; Ten kate, N.; Lugier, O. Method and Apparatus for Forming a Patterned Layer of Carbon, Method of Forming a Patterned Layer of Material. WO2019166409A1, 2019.
28. 10.1002/adma.20180632410.1002/adma.201806324 ↗
29. 10.1021/acs.langmuir.1c0024510.1021/acs.langmuir.1c00245 ↗
30. 10.2494/photopolymer.33.22910.2494/photopolymer.33.229 ↗
31. 10.1016/j.colsurfa.2011.09.02010.1016/j.colsurfa.2011.09.020 ↗
32. 10.1021/la050245v10.1021/la050245v ↗
33. 10.1021/la00093a02610.1021/la00093a026 ↗
34. 10.1016/j.jcis.2011.10.08110.1016/j.jcis.2011.10.081 ↗
35. 10.1021/la700773310.1021/la7007733 ↗
36. 10.1002/admt.20180041310.1002/admt.201800413 ↗
37. 10.1039/c1cs15276a10.1039/c1cs15276a ↗
38. 10.1002/chem.20200059410.1002/chem.202000594 ↗
39. 10.1039/a902013f10.1039/a902013f ↗
40. 10.1021/ja070120810.1021/ja0701208 ↗
41. 10.1002/sia.74020011210.1002/sia.740200112 ↗
42. Naumkin, A.; Kraut-Vass, A.; Gaarenstroom, S.; Powell, C. NIST X-ray Photoelectron Spectroscopy Database. https://srdata.nist.gov/xps/Default.aspx (accessed Jan 1, 2017).
43. 10.1080/08940886.2019.163443110.1080/08940886.2019.1634431 ↗
44. 10.2494/photopolymer.30.61310.2494/photopolymer.30.613 ↗
45. 10.1021/acs.cgd.0c0052910.1021/acs.cgd.0c00529 ↗
46. 10.1039/b907301a10.1039/b907301a ↗
47. 10.1016/j.mee.2006.01.14910.1016/j.mee.2006.01.149 ↗