Nonpatterned Soft Piezoresistive Films with Filamentous Conduction Paths for Mimicking Multiple-Resolution Receptors of Human Skin
Source abstract
Abstract
Soft pressure sensors play key roles as input devices of electronic skin (E-skin) to imitate real human skin. For efficient data acquisition according to stimulus types such as detailed pressure images or macroscopic strength of stimuli, soft pressure sensors can have variable spatial resolution, just like the uneven spatial distribution of pressure-sensing receptors on the human body. However, previous methods on soft pressure sensors cannot achieve such tunability of spatial resolution because their sensor materials and read-out electrodes need to be elaborately patterned for a specific sensor density. Here, we report a universal soft pressure-sensitive platform based on anisotropically self-assembled ferromagnetic particles embedded in elastomer matrices whose spatial resolution can be facilely tuned. Various spatial densities of pressure-sensing receptors of human body parts can be implemented by simply sandwiching the film between soft electrodes with different pitches. Since the anisotropically aligned nickel particles form independent filamentous conductive paths, the pressure sensors show spatial sensing ability without crosstalk, whose spatial resolution up to 100 dpi can be achieved from a single platform. The sensor array shows a wide dynamic range capable of detecting various pressure levels, such as liquid drops (∼30 Pa) and plantar (∼300 kPa) pressures. Our universal soft pressure-sensing platform would be a key enabling technology for actually imitating the receptor systems of human skin in robot and biomedical applications.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Tactile and Sensory Interactions · Nanomaterials and Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Electrical and Computer Engineering, Inter-University Semiconductor Research Center (ISRC), Seoul National University, Seoul08826, Korea
Samsung Electronics, Suwon, Gyeonggi-do16677, Korea
Soft Hybrid Materials Research Center, Korea Institute of Science and Technology, Seoul02792, Korea
Funding
Ministry of Trade, Industry and Energy
References (58)
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