Toward the Assembly of 2D Tunable Crystal Patterns of Spherical Colloids on a Wafer-Scale

Entering an era of miniaturization prompted scientists to explore strategies to assemble colloidal crystals for numerous applications, including photonics. However, wet methods are intrinsically less versatile than dry methods, whereas the manual rubbing method of dry powders has been demonstrated only on sticky elastomeric layers, hindering particle transfer in printing applications and applicability in analytical screening. To address this clear impetus of broad applicability, we explore here the assembly on nonelastomeric, rigid substrates by utilizing the manual rubbing method to rapidly (≈20 s) attain monolayers comprising hexagonal closely packed (HCP) crystals of monodisperse dry powder spherical particles with a diameter ranging from 500 nm to 10 μm using a PDMS stamp. Our findings elucidate that the tribocharging-induced electrostatic attraction, particularly on relatively stiff substrates, and contact mechanics force between particles and substrates are critical contributors to attain large-scale HCP structures on conductive and insulating substrates. The best performance was obtained with polystyrene and PMMA powder, while silica was assembled only in HCP structures on fluorocarbon-coated substrates under zero-humidity conditions. Finally, we successfully demonstrated the assembly of tunable crystal patterns on a wafer-scale with great control on fluorocarbon-coated wafers, which is promising in microelectronics, bead-based assays, sensing, and anticounterfeiting applications.