Data-Driven Framework toward Accurate Prediction of Interfacial Thermal Resistance in Particulate-Filled Composites
Abstract
Research context
OpenAlex topics: Thermal properties of materials · Composite Material Mechanics · Heat Transfer and Optimization
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518103, P. R. China
Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518103, P. R. China
School of Electronic Science & Engineering, Southeast University, Nanjing 210096, P. R. China
Department of Electronics Engineering and Materials Science and Technology Research Center, The Chinese University of Hong Kong, Shatin, New Territories, Hong Kong 999077, China
SIAT CAS-CUHK Joint Laboratory of Materials and Devices for High Density Electronic Packaging, Shenzhen 518055, China
Funding
Tip-top Scientific and Technical Innovative Youth Talents of Guangdong Special Support Program · Shenzhen Fundamental Research Program · Basic and Applied Basic Research Foundation of Guangdong Province · Youth Innovation Promotion Association of the Chinese Academy of Sciences · National Natural Science Foundation of China · Guangdong Provincial Key Laboratory