Achieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper

Cu layers were fabricated on PET films with and without pretreatment by a mixed plasma composed of carbon and copper using a magnetron sputtering technique for potential application as the flexible copper-clad laminate (FCCL) in 5G technology. In order to evaluate the effect of carbon plasma on the composited layer, the graphite target current was adjusted from 0.5 to 2.0 A. The microstructures and properties of Cu layers on PET films with different treatments were measured by an X-ray powder diffractometer, X-ray photoelectron spectroscope, Raman spectroscope, scanning electron microscope, transmission electron microscope, scratching test, indentation test, and four-probe detector. The results showed that the organic polymer carbon structure on the surface of PET films was changed to inorganic amorphous carbon due to the effect of the carbon plasma. At the same time, the active free radicals formed in the transition process react with metal copper ions to form organometallic compounds. Under the treatment of a mixed plasma of carbon and copper, the C/Cu mixed layer was formed on the PET film at the top of the substrate. Due to the presence of C/Cu mixed interlayers, the bonding strengths between the final Cu layers and the PET film substrates were improved, and the strongest bonding strength appeared when the graphite target current was 1.0 A. In addition, the presence of the C/Cu mixed interlayer enhanced the toughness of the Cu layer on PET film. It was proposed that the good bonding strength in combination and the enhanced toughness for the Cu layer on a PET film was due to the formation of a C/Cu mixed interlayer induced by the pretreatment of a mixed plasma of carbon and copper.