Bismuth Tungstate–Silver Sulfide Z-Scheme Heterostructure Nanoglue Promotes Wound Healing through Wound Sealing and Bacterial Inactivation

Rapid wound closure and bacterial inactivation are effective strategies to promote wound healing. Herein, a versatile nanoglue, bismuth tungstate (Bi2WO6)–silver sulfide (Ag2S) direct Z-scheme heterostructure nanoparticles (BWOA NPs), was designed to accelerate wound healing. BWOA NPs’ hollow structure and rough surface could effectively close wound tissues acting as a barrier between external bacteria and the wound. More importantly, the unique Z-scheme heterostructure endows BWOA NPs with an effective electron and hole separating ability with potent redox potential, where electrons and holes could effectively react with water and oxygen to produce reactive oxygen species, leading to a higher antibacterial activity against both endogenous and external bacteria at the wound site. A series of in vitro and in vivo biological assessments demonstrated that BWOA NPs could rapidly close wounds and promote wound healing. With sunlight irradiation, the inhibiting rates of BWOA NPs against Escherichia coli and Staphylococcus aureus are 61.62 ± 2.85 and 73.40 ± 3.28%, respectively. Also, the wound healing rate in BWOA NP-treated mice is 25.90 ± 5.85% higher than PBS. This design provides a new effective strategy to promote bacterial inactivation and accelerate wound healing.