Bonding Performance of Ag–Cu Brazing Solders and Half-Heusler Alloys for High-Performance Thermoelectric Generators

Due to the uncertainty of the brazing solder composition and its unknown effect on the long-term stability of the interface, the brazing interface connection process for half-Heusler (hH) thermoelectric (TE) devices is still partially concealed and incomplete. In this work, we selected different types of Ag-Cu-based brazing solders with different Ag and Cu contents to assemble hH TE devices, observed the microstructure of the interface contact, and analyzed its formation mechanism. It is found that when the Cu element in the brazing solder is high, it tends to form an intermetallic compound (IMC) layer at the interface, which threatens the life of the device. On the contrary, when the content of the Ag element is high, the formation of the IMC layer will be avoided. Then, the long-term stability of the interface brazed by Ag72Cu28 with high Ag content was verified: the interface connection showed good contact resistivity stability and mechanical reliability; the fabricated uni-couple TE module achieved a maximum output power of 0.28 W and a maximum conversion efficiency of 7.34% at a temperature difference of 538 K. This work summarizes the selection principle of Cu-Ag-based brazing solder when assembling hH TE modules and verifies the long-term stability of the brazed connection interface. The experiment results can provide a reference for the actual fabrication of hH TE devices.