journal article·2019-11-06

Direct Writing of Microfluidic Three-Dimensional Photonic Crystal Structures for Terahertz Technology Applications

Xiaojing Ju, Weiyi Yang, Shuang Gao, Qi Li

ACS Applied Materials & Interfaces· Volume 11· Issue 44
Publisher page

Abstract

The direct writing technology was used to create microfluidic three-dimensional terahertz photonic crystal structures (3D-TPCSs) with a glass cement ink, which demonstrated potentials for various terahertz technology applications. By a simple injection of liquid alloy into them, metallic 3D-TPCSs could be created easily at a low cost to solve the challenges of their creation by current approaches. These microfluidic 3D-TPCSs also possessed a specific capability of changing their terahertz properties in real time without structural changes by injecting fluidic media with different dielectric properties into their microfluidic channels, which endowed them the easy integration into various terahertz devices that require terahertz modulation for a wide range of applications. Due to their microsized channel structure and subsequent reduction of terahertz irradiation absorption by water in them, they demonstrated the potential as real time, nondestructive biological and chemical sensors to detect changes occurring in them in the fluidic media with the terahertz time-domain spectroscopy (THz-TDS).
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Research context

OpenAlex topics: Terahertz technology and applications · Photonic Crystals and Applications · Photonic and Optical Devices

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, P. R. China

Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, P. R. China

School of Materials Science and Engineering, Southwest Jiaotong University, Chengdu 610031, P. R. China

Funding

Ministry of Education of the People's Republic of China · National Natural Science Foundation of China · Shenyang National Laboratory for Materials Science

References (31)

Show source-provided references
1. 10.1038/nphoton.2007.310.1038/nphoton.2007.3 ↗
2. 10.1088/1361-6463/50/4/04300110.1088/1361-6463/50/4/043001 ↗
3. 10.1088/0268-1242/20/7/01810.1088/0268-1242/20/7/018 ↗
4. 10.1038/s41598-017-13612-910.1038/s41598-017-13612-9 ↗
5. 10.1016/j.foodcont.2018.10.02410.1016/j.foodcont.2018.10.024 ↗
6. 10.1088/1361-6463/ab146d10.1088/1361-6463/ab146d ↗
7. 10.1016/j.dit.2013.03.00910.1016/j.dit.2013.03.009 ↗
8. 10.1021/acs.jpclett.9b0109110.1021/acs.jpclett.9b01091 ↗
9. 10.1007/s10762-017-0391-010.1007/s10762-017-0391-0 ↗
10. 10.1063/1.492724210.1063/1.4927242 ↗
11. 10.1038/386143a010.1038/386143a0 ↗
12. 10.1002/1521-4095(20020916)14:18<1279::AID-ADMA1279>3.0.CO;2-A10.1002/1521-4095(20020916)14:18<1279::AID-ADMA1279>3.0.CO;2-A ↗
13. Kaur, A.; Myers, J. C.; Ghazali, M. I.; Byford, M. J.; Chahal, P. In Affordable Terahertz Components Using 3D Printing, Proceedings of the IEEE 65th Electronic Components and Technology Conference (ECTC), 2015; pp 2071–2076.10.1109/ECTC.2015.7159888 ↗
14. 10.1039/C5RA22737B10.1039/C5RA22737B ↗
15. 10.1063/1.220087310.1063/1.2200873 ↗
16. 10.1007/s11468-014-9734-z10.1007/s11468-014-9734-z ↗
17. 10.1117/12.224635410.1117/12.2246354 ↗
18. 10.1063/1.199986110.1063/1.1999861 ↗
19. 10.1063/1.325107910.1063/1.3251079 ↗
20. 10.1063/1.472420410.1063/1.4724204 ↗
21. 10.1063/1.479883610.1063/1.4798836 ↗
22. 10.1002/adma.20170616410.1002/adma.201706164 ↗
23. 10.1016/j.matdes.2018.02.04010.1016/j.matdes.2018.02.040 ↗
24. 10.1021/acsami.8b1285310.1021/acsami.8b12853 ↗
25. 10.1039/C7LC00426E10.1039/C7LC00426E ↗
26. 10.1111/jace.1534710.1111/jace.15347 ↗
27. 10.1002/adom.20160097710.1002/adom.201600977 ↗
28. 10.1016/j.optcom.2014.01.08610.1016/j.optcom.2014.01.086 ↗
29. 10.1016/j.physb.2012.09.01610.1016/j.physb.2012.09.016 ↗
30. 10.1063/1.292937610.1063/1.2929376 ↗
31. 10.1002/adom.20140009410.1002/adom.201400094 ↗