Applicable Superamphiphobic Ni/Cu Surface with High Liquid Repellency Enabled by the Electrochemical-Deposited Dual-Scale Structure

Until now, scalable fabrication and utilization of superamphiphobic surfaces based on sophisticated structures has remained challenging. Herein, we develop an applicable superamphiphobic surface with nano-Ni pyramid/micro-Cu cone structures prepared by cost-effective electrochemical deposition. More importantly, excellent dynamic wettability is achieved, exhibiting as ultralow sliding angle (∼0°), multiple droplets rebounding (13 times), and a total rejection. The supportive cushions trapped within the dual-scale micro/nanostructures is proved to be the key factor contributing to such high liquid repellency, whose existence is intuitively ascertained at both solid-air-liquid and water-solid-oil systems in this work. In addition, the enduring reliability of the wetting performance under various harsh conditions further endows the surface with broader application prospects.