Metal–Organic–Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances

Cengiz Yegin; Nirup Nagabandi; Xuhui Feng; Charles King; Massimo Catalano; Jun Kyun Oh; Ansam J. Talib; Ethan A. Scholar; Stanislav V. Verkhoturov; Tahir Cagin; Alexei V. Sokolov; Moon J. Kim; Kaiser Matin; Sreekant Narumanchi; Mustafa Akbulut

doi:10.1021/acsami.7b00093

journal article·2017-03-22Open access

Metal–Organic–Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances

Cengiz Yegin, Nirup Nagabandi, Xuhui Feng, Charles King, Massimo Catalano, Jun Kyun Oh, Ansam J. Talib, Ethan A. Scholar, Stanislav V. Verkhoturov, Tahir Cagin, Alexei V. Sokolov, Moon J. Kim, Kaiser Matin, Sreekant Narumanchi, Mustafa Akbulut

ACS Applied Materials & Interfaces· Volume 9· Issue 11

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Source abstract

Abstract

As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Herein, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix—which are prepared by the chemisorption-coupled electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m K), which are very high considering their relatively low elastic modulus values on the order of 21.2–28.5 GPa. The synergistic combination of these properties led to the ultralow total thermal resistivity values in the range of 0.38–0.56 mm 2 K/W for a typical bond-line thickness of 30–50 μm, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.

Source: openalex_inverted_index · Quality: baseline

Research context

Nanomaterials

OpenAlex topics: Thermal properties of materials · Thermal Expansion and Ionic Conductivity · Advanced ceramic materials synthesis

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering, Texas A&M University, 3003 TAMU, College Station, Texas 77843-3003, United States

Artie McFerrin Department of Chemical Engineering, Texas A&M University, 3122 TAMU, College Station, Texas 77843-3122, United States

National Renewable Energy Laboratory (NREL), 15013 Denver West Parkway, Golden, Colorado 80401, United States

CNR-IMM, Institute Microelectronics and Microsystems, National Council for Research, Via Monteroni, 73100 Lecce, Italy

Materials Science and Engineering Department, University of Texas at Dallas, 800 W. Campbell Rd., Richardson, Texas 75080, United States

Department of Physics and Astronomy and Institute for Quantum Science and Engineering, Texas A&M University, 4242 TAMU, College Station, Texas 77843-4242, United States

Department of Chemistry, Texas A&M University, 3012 TAMU, College Station, Texas 77843-3012, United States

Microsystems Technology Office, Defense Advanced Research Project Agency, 675 N Randolph St., Arlington, Virginia 22203, United States

Funding

Welch Foundation · Defense Advanced Research Projects Agency · Directorate for Engineering

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