E-Textile by Printing an All-through Penetrating Copper Complex Ink
Source abstract
Abstract
Wearable electronics is an emerging field in academics and industry, in which electronic devices, such as smartwatches and sensors, are printed or embedded within textiles. The electrical circuits in electronics textile (e-textile) should withstand many cycles of bending and stretching. Direct printing of conductive inks enables the patterning of electrical circuits; however, while using conventional nanoparticle-based inks, printing onto the fabric results in a thin layer of a conductor, which is not sufficiently robust and impairs the reliability required for practical applications. Here, we present a new process for fabricating robust stretchable e-textile using a thermodynamically stable, solution-based copper complex ink, which is capable of full penetrating the fabric. After printing on knitted stretchable fabrics, they were heated, and the complex underwent an intermolecular self-reduction reaction. The continuously formed metallic copper was used as a seed layer for electroless plating (EP) to form highly conductive circuits. It was found that the stretching direction has a significant role in resistivity. This new approach enables fabricating e-textiles with high stretchability and durability, as demonstrated for wearable gloves, toward printing functional e-textile.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Conducting polymers and applications · Nanomaterials and Printing Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Casali Center for Applied Chemistry, Institute of Chemistry, The Hebrew University of Jerusalem, 91904 Jerusalem, Israel
Funding
AMat Singapore
References (53)
Show source-provided references
1. Wearable Technology Market by Product (Wristwear, Headwear, Footwear, Fashion & Jewelry, Bodywear), Type (Smart Textile, Non-textile), Application (Consumer Electronics, Healthcare, Enterprise & Industrial), and Geography (2021–2026), 2016. https://www.marketsandmarkets.com/Market-Reports/wearable-electronics-market-983/html#:∼:text=%5B241 Pages Report%5D The global,18.0%25 from 2021 to 2026.
2. 10.1038/nmat188410.1038/nmat1884 ↗
3. 10.1088/0964-1726/23/5/05300110.1088/0964-1726/23/5/053001 ↗
4. Kuzubaşoğlu B. A. · 2021 · 1
5. 10.1016/j.chb.2016.07.04710.1016/j.chb.2016.07.047 ↗
6. 10.3390/s14071195710.3390/s140711957 ↗
7. 10.1126/science.147.3656.37310.1126/science.147.3656.373 ↗
8. Spandex Market Size, Share & Trends Analysis Report by Technology (Wet-Spinning, Solution Dry-Spinning), by Application (Clothing, Medical), by Region (APAC, North America, MEA), and Segment Forecasts, 2020-2027. https://www.grandviewresearch.com/industry-analysis/spandex-market.
9. 10.1007/bf0287577510.1007/bf02875775 ↗
10. 10.1177/00405175030730010210.1177/004051750307300102 ↗
11. 10.3390/electronics1101009910.3390/electronics11010099 ↗
12. 10.1002/adma.20150000910.1002/adma.201500009 ↗
13. 10.1109/led.2004.82653710.1109/led.2004.826537 ↗
14. 10.1016/j.nanoen.2020.10532710.1016/j.nanoen.2020.105327 ↗
15. 10.1039/d1nr02061g10.1039/d1nr02061g ↗
16. Chen A. · Adv. Intell. Syst. Comput. · 2019 · 849 · 12910.1007/978-3-319-99695-0_16 ↗
17. 10.1021/acsami.9b0643210.1021/acsami.9b06432 ↗
18. 10.1007/s12274-014-0649-y10.1007/s12274-014-0649-y ↗
19. 10.1007/s12274-010-0020-x10.1007/s12274-010-0020-x ↗
20. 10.1021/am100036n10.1021/am100036n ↗
21. 10.1002/aelm.20140003810.1002/aelm.201400038 ↗
22. 10.1007/s12274-014-0649-y10.1007/s12274-014-0649-y ↗
23. 10.1002/adma.20190298710.1002/adma.201902987 ↗
24. 10.1002/asia.20140223010.1002/asia.201402230 ↗
25. 10.1021/am900744n10.1021/am900744n ↗
26. 10.1021/acsaelm.8b0011510.1021/acsaelm.8b00115 ↗
27. 10.1088/1361-665x/abe4b310.1088/1361-665x/abe4b3 ↗
28. 10.1016/j.apsusc.2010.10.12910.1016/j.apsusc.2010.10.129 ↗
29. 10.1016/j.porgcoat.2016.08.01910.1016/j.porgcoat.2016.08.019 ↗
30. 10.1002/adma.20160584810.1002/adma.201605848 ↗
31. 10.1016/j.renene.2014.03.03210.1016/j.renene.2014.03.032 ↗
32. 10.1016/j.apmt.2019.10045110.1016/j.apmt.2019.100451 ↗
33. 10.1021/acsami.1c2163310.1021/acsami.1c21633 ↗
34. 10.1016/j.intermet.2011.08.01410.1016/j.intermet.2011.08.014 ↗
35. Hare, B. E.; Ph, D. Intermetallics in Solder Joints; SEM Lab, Inc. www.semlab.com/papers2017/intermetallics-in-solder-joints.pdf.
36. 10.1007/bf0111191610.1007/bf01111916 ↗
37. 10.1002/admi.20190100210.1002/admi.201901002 ↗
38. 10.1039/c4cc08749f10.1039/c4cc08749f ↗
39. 10.1002/admi.20170128510.1002/admi.201701285 ↗
40. 10.1143/jjap.49.08650110.1143/jjap.49.086501 ↗
41. 10.3390/polym1417346710.3390/polym14173467 ↗
42. 10.1080/00405000.2021.190323810.1080/00405000.2021.1903238 ↗
43. Lavanya D. K. P. K. · Int. J. DRUG Formul. Res. · 2011 · 2 · 19
44. 10.1016/j.indcrop.2022.11590710.1016/j.indcrop.2022.115907 ↗
45. 10.3390/polym911059710.3390/polym9110597 ↗
46. 10.1016/j.jcis.2021.09.13010.1016/j.jcis.2021.09.130 ↗
47. 10.1016/j.carbpol.2020.11730210.1016/j.carbpol.2020.117302 ↗
48. 10.1039/d2cc02940e10.1039/d2cc02940e ↗
49. 10.1177/155892502091387110.1177/1558925020913871 ↗
50. 10.1021/am900744n10.1021/am900744n ↗
51. 10.1002/mame.20160023410.1002/mame.201600234 ↗
52. 10.2196/mhealth.934110.2196/mhealth.9341 ↗
53. 10.1016/j.carbpol.2009.10.07110.1016/j.carbpol.2009.10.071 ↗