Realization of Self-Compliance Resistive Switching Memory via Tailoring Interfacial Oxygen
Source abstract
Abstract
Self-compliance set switching (SCSS) offers the promise of a selector-less resistive random access memory (RRAM) implementation on flexible substrates, with great application in integrated flexible electronics. SCSS has been realized in RRAM devices with a series oxide layer incorporated into the memory stack. The series oxide acts as an in-built resistor, limiting the increase of the current during set transition. In this study, we show that SCSS can also be achieved in a bipolar RRAM cell without a series oxide layer, i.e., consisting of only a single switching oxide layer. This study reveals that oxygen pileup at the anode interface during the set evolution plays a crucial role in SCSS. The accumulation of oxygen gives rise to the increase of the switching oxide resistance, partially compensating the decrease of the filament resistance, and modulates the conduction barrier at the anode/oxide interface, which self-arrests the increase of the set switching current. Our results show interface engineering as a possible route for enabling SCSS in an RRAM device without the need for a complicated stack structure and careful thickness optimization.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Memory and Neural Computing · Ferroelectric and Negative Capacitance Devices · Neuroscience and Neural Engineering
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
Division of Microelectronics Science and Engineering, School of Science, Ningbo University, Ningbo 315211, China
Institute of Materials Researc h and Engineering, A*STAR (Agency for Science, Technology and Research), 2 Fusionopolis Way, Innovis, #08-03, Singapore 138634
Funding
Ministry of Education - Singapore · Nanyang Technological University
References (33)
Show source-provided references
1. 10.1109/JPROC.2009.202107710.1109/JPROC.2009.2021077 ↗
2. 10.4103/0256-4602.4846210.4103/0256-4602.48462 ↗
3. Govoreanu, B.; Kar, G. S.; Chen, Y.Y.; Paraschiv, V.; Kubicek, S.; Fantini, A.; Radu, I. P.; Goux, L.; Clima, S.; Degraeve, R. In 10 × 10 nm2 Hf/HfOx Crossbar Resistive RAM with Excellent Performance, Reliability and Low-Energy Operation, 2011 International Electron Devices Meeting; IEEE, 2011; pp 729–732.
4. Wei, Z.; Takagi, T.; Kanzawa, Y.; Katoh, Y.; Ninomiya, T.; Kawai, K.; Muraoka, S.; Mitani, S.; Katayama, K.; Fujii, S. In Demonstration of High-Density ReRAM Ensuring 10-Year Retention at 85 °C Based on A Newly Developed Reliability Model, 2011 International Electron Devices Meeting; IEEE, 2011; pp 31.4.1–31.4.4.10.1109/IEDM.2011.6131650 ↗
5. 10.1038/nmat307010.1038/nmat3070 ↗
6. 10.1021/acsami.8b1838610.1021/acsami.8b18386 ↗
7. 10.1002/aelm.20180041810.1002/aelm.201800418 ↗
8. 10.1149/08903.0039ecst10.1149/08903.0039ecst ↗
9. 10.1002/aelm.20170056110.1002/aelm.201700561 ↗
10. Luo, Q.; Xu, X.; Liu, H.; Lv, H.; Gong, T.; Long, S.; Liu, Q.; Sun, H.; Banerjee, W.; Li, L. In Demonstration of 3D Vertical RRAM with Ultra Low-Leakage, High-Selectivity and Self-Compliance Memory Cells, 2015 IEEE International Electron Devices Meeting; IEEE, 2015; pp 10.2.1–10.2.4.10.1109/IEDM.2015.7409667 ↗
11. 10.1021/acsami.6b0815410.1021/acsami.6b08154 ↗
12. 10.1021/nl203206h10.1021/nl203206h ↗
13. 10.1021/acsnano.6b0757710.1021/acsnano.6b07577 ↗
14. 10.1002/adma.20100294610.1002/adma.201002946 ↗
15. 10.1002/adfm.20150477110.1002/adfm.201504771 ↗
16. 10.1021/nn305510u10.1021/nn305510u ↗
17. 10.1021/nn302877610.1021/nn3028776 ↗
18. 10.1038/nmat274810.1038/nmat2748 ↗
19. 10.1063/1.471919810.1063/1.4719198 ↗
20. 10.1063/1.486465310.1063/1.4864653 ↗
21. 10.1021/acsami.6b0891510.1021/acsami.6b08915 ↗
22. 10.1109/LED.2010.210104410.1109/LED.2010.2101044 ↗
23. 10.1088/0957-4484/26/3/03520310.1088/0957-4484/26/3/035203 ↗
24. 10.1016/j.optmat.2004.04.01410.1016/j.optmat.2004.04.014 ↗
25. 10.1016/j.mee.2013.03.13210.1016/j.mee.2013.03.132 ↗
26. 10.1038/nnano.2009.45610.1038/nnano.2009.456 ↗
27. 10.1088/0957-4484/22/45/45570210.1088/0957-4484/22/45/455702 ↗
28. 10.1109/TED.2003.81514110.1109/TED.2003.815141 ↗
29. 10.1186/s11671-015-0846-y10.1186/s11671-015-0846-y ↗
30. 10.1021/acsami.6b1609810.1021/acsami.6b16098 ↗
31. Traoré, B.; Blaise, P.; Vianello, E.; Jalaguier, E.; Molas, G.; Nodin, J. F.; Perniola, L.; De Salvo, B.; Nishi, Y. In Impact of Electrode Nature on The Filament Formation and Variability in HfO2 RRAM, 2014 IEEE International Reliability Physics Symposium; IEEE, 2014; pp 5E.2.1–5E.2.5.10.1109/IRPS.2014.6860676 ↗
32. 10.1109/TED.2014.231294310.1109/TED.2014.2312943 ↗
33. 10.1007/BF0157508510.1007/BF01575085 ↗