Ligand-Dependent Nanoparticle Assembly and Its Impact on the Printing of Transparent Electrodes

Metal grids with submicron line diameters are optically transparent, mechanically flexible, and suitable materials for transparent and flexible electronics. Printing such narrow lines with dilute metal nanoparticle inks is challenging because it requires percolation throughout the particle packing. Here, we print fully connected submicron lines of 3.2 nm diameter gold nanoparticles and vary the organic ligand shell to study the relation between colloidal interactions, ligand binding to the metal core, and conductivity of the printed lines. We find that particles with repulsive potentials aid the formation of continuous lines, but the required long ligand molecules impede conductivity and need to be removed after printing. Weakly bound alkylamines provided sufficient interparticle repulsion and were easy to remove with a soft plasma treatment after printing, so that grids with a transparencies above 90% and a conductivity of 150 Ω sq –1 could be printed.