journal article·2022-09-14

AWI-Assembled TPU-BNNS Composite Films with High In-Plane Thermal Conductivity for Thermal Management of Flexible Electronics

Qiaoli Wang, Tianshuo Li, Yafei Ding, Huibao Chen, Xiyue Cao, Jianfei Xia, Baowen Li, Bin Sun

ACS Applied Materials & Interfaces· Volume 14· Issue 36
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Abstract

Thermal management of flexible/stretchable electronics has been a crucial issue. Mass supernumerary thermal heat is created in the repetitive course of deformation because of the large nanocontact resistance between electric conductive fillers, as well as the interfacial resistance between fillers and the polymer matrix. Here, we report a stretchable thermoplastic polyurethane (TPU)-boron nitride nanosheet (BNNS) composite film with a high in-plane thermal conductivity based on an air/water interfacial (AWI) assembly method. In addition to rigid devices, it was capable for thermal management of flexible electronics. During more than 2000 cycles of the bending-releasing process, the average saturated surface temperature of the flexible conductor covered with composite film with 30 wt % BNNSs was approximately 40.8 ± 1 °C (10.5 °C lower than that with pure TPU). Moreover, the thermal dissipating property of the composite under stretching was measured. All the results prove that this TPU-BNNS composite film is a candidate for thermal management of next-generation flexible/stretchable electronics with high power density.
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Research context

OpenAlex topics: Thermal properties of materials · Advanced Thermoelectric Materials and Devices · Thermal Radiation and Cooling Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

College of Physics, Qingdao University, Qingdao 266071, P. R. China

College of Electronics and Information, Qingdao University, Qingdao 266071, P. R. China

Department of Basic, Ma’anshan University, Ma’anshan 243100, P. R. China

Department of Material Science and Engineering, Department of Physics, Shenzhen Institute for Quantum Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, P. R. China

College of Chemistry and Chemical Engineering, Shandong Sino-Japanese Center for Collaborative Research of Carbon Nanomaterials, Instrumental Analysis Center of Qingdao University, Qingdao University, Qingdao 266071, P. R. China

Paul M. Rady Department of Mechanical Engineering and Department of Physics, University of Colorado, Boulder, Colorado 80305-0427, United States

Weihai Innovation Research Institute, Qingdao University, Weihai 264200, P. R. China

Funding

Natural Science Foundation of Shandong Province

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