journal article·2018-06-27

Insight into the Near-Conduction Band States at the Crystallized Interface between GaN and SiNx Grown by Low-Pressure Chemical Vapor Deposition

Xinyu Liu, Xinhua Wang, Yange Zhang, Ke Wei, Yingkui Zheng, Xuanwu Kang, Haojie Jiang, Junfeng Li, Wenwu Wang, Xuebang Wu, Xianping Wang, Sen Huang

ACS Applied Materials & Interfaces· Volume 10· Issue 25
Publisher page

Abstract

Constant-capacitance deep-level transient Fourier spectroscopy is utilized to characterize the interface between a GaN epitaxial layer and a SiNx passivation layer grown by low-pressure chemical vapor deposition (LPCVD). A near-conduction band (NCB) state ELP (EC – ET = 60 meV) featuring a very small capture cross section of 1.5 × 10–20 cm–2 was detected at 70 K at the LPCVD-SiNx/GaN interface. A partially crystallized Si2N2O thin layer was detected at the interface by high-resolution transmission electron microscopy. Based on first-principles calculations of crystallized Si2N2O/GaN slabs, it was confirmed that the NCB state ELP mainly originates from the strong interactions between the dangling bonds of gallium and its vicinal atoms near the interface. The partially crystallized Si2N2O interfacial layer might also give rise to the very small capture cross section of the ELP owing to the smaller lattice mismatch between the Si2N2O and GaN epitaxial layer and a larger mean free path of the electron in the crystallized portion compared with an amorphous interfacial layer.
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Research context

OpenAlex topics: GaN-based semiconductor devices and materials · Ga2O3 and related materials · ZnO doping and properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

High-Frequency High-Voltage Device and Integrated Circuits R&D Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China

Key Laboratory of Microelectronic Devices & Integrated Technology, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China

Institute of Solid State Physics, Chinese Academy of Sciences, Hefei 230031, China

Integrated Circuit Advanced Process Center, Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China

Funding

Ministry of Science and Technology of the People's Republic of China · National Natural Science Foundation of China · Chinese Academy of Sciences · Key Laboratory of Microelectronic Devices and Integrated Technology · University of Chinese Academy of Sciences

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