journal article·2017-10-11

Atomic Layer Deposition of Rhenium–Aluminum Oxide Thin Films and ReOx Incorporation in a Metal–Organic Framework

Martino Rimoldi, Joseph T. Hupp, Omar K. Farha

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Abstract

Methyltrioxorhenium (ReO 3 Me) is introduced as the first rhenium atomic layer deposition (ALD) precursor and used to grow rhenium–aluminum oxide thin films in combination with trimethylaluminum (TMA–AlMe 3 ). The growth rate of the smooth Re–Al oxide films, with general stoichiometry Re x Al y O 3 x, has been monitored by in situ quartz crystal microbalance (QCM) and ex situ ellipsometry, and found to be 3.2 Å/cycle. X-ray photoelectron spectroscopy (XPS) revealed the mixed valent composition of the film with Re(III) species being the main component. In addition, ReO 3 Me has been successfully used to deposit rhenium oxide in NU-1000, a mesoporous zirconium-based metal–organic framework (MOF). The metalated MOF was found to retain porosity and crystallinity and to be catalytically active for ethene hydrogenation.
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Research context

OpenAlex topics: Semiconductor materials and devices · Electronic and Structural Properties of Oxides · Catalytic Processes in Materials Science

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Chemistry, Northwestern University, 2145 Sheridan Road, Evanston, Illinois 60208, United States

Department of Chemistry, Faculty of Science, King Abdulaziz University, Jeddah 21589, Saudi Arabia

Funding

Basic Energy Sciences

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