journal article·2019-11-27Open access

Simultaneous Enhancement of Thermopower and Electrical Conductivity through Isovalent Substitution of Cerium in Bismuth Selenide Thermoelectric Materials

Jamal-Deen Musah, Xiao Yanjun, A. M. Ilyas, Travis G. Novak, Seokwoo Jeon, Clement Arava, S. V. Novikov, D. S. Nikulin, Wei Xu, Liyao Liu, Asaduzzaman Md, Kwok-Ho Lam, Xianfeng Chen, Chi-Man Lawrence Wu, Vellaisamy A. L. Roy

ACS Applied Materials & Interfaces· Volume 11· Issue 47

Abstract

It is challenging to achieve highly efficient thermoelectric materials due to the conflicts between thermopower (Seebeck coefficient) and electrical conductivity. These parameters are the core factors defining the thermoelectric property of any material. Here, we report the use of isovalent substitution as a tool to decouple the interdependency of the Seebeck coefficient and the electrical properties of cerium-doped bismuth selenide thermoelectric material. With this strategy, we can achieve a simultaneous increase in both the electrical conductivity and the Seebeck coefficient of the material by tuning the concentration of cerium doping, due to formation of neutral impurities and consequently the improvement of carrier mobility. Our theoretical calculation reveals a downward shift of the valence band with cerium concentration, which influences the thermoelectric enhancement of the synthesized materials. Finally, an order of magnitude enhancement of the figure of merit is obtained due to isovalent substitution, thus providing a new avenue for enhancing the thermoelectric performance of materials.
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Research context

OpenAlex topics: Advanced Thermoelectric Materials and Devices · Chalcogenide Semiconductor Thin Films · Thermal properties of materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Material Science and Engineering and State Key Laboratory of Terahertz and Millimeter Waves, City University of Hong Kong, Kowloon, Hong Kong SAR, China

Department of Materials Science and Engineering, City University of Hong Kong, Kowloon, Hong Kong SAR, China

Department of Materials Science and Engineering, Flexible Devices and Metamaterials Lab, KAIST, Daejeon 34141, Korea

Ioffe Institute, St Petersburg 194021, Russia

Termointech, Zelenograd, Moscow 117403, Russia

Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, China

Department of Electrical Engineering, The Hong Kong Polytechnic University, Kowloon, Hong Kong SAR, China

School of Engineering, Institute for Bioengineering, The University of Edinburgh, King’s Buildings, Mayfield Road, Edinburgh EH9 3JL, U.K.

Funding

Research Grants Council, University Grants Committee

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