journal article·2014-05-28

Controlling the Al-Doping Profile and Accompanying Electrical Properties of Rutile-Phased TiO2 Thin Films

Woojin Jeon, Sang Ho Rha, Woongkyu Lee, Yeon Woo Yoo, Cheol Hyun An, Kwang Hwan Jung, Seong Keun Kim, Cheol Seong Hwang

Publisher page

Abstract

The role of Al dopant in rutile-phased TiO2 films in the evaluation of the mechanism of leakage current reduction in Al-doped TiO2 (ATO) was studied in detail. The leakage current of the ATO film was strongly affected by the Al concentration at the interface between the ATO film and the RuO2 electrode. The conduction band offset of the interface increased with the increase in the Al dopant concentration in the rutile TiO2, which reduced the leakage current in the voltage region pertinent to the next-generation dynamic random access memory application. However, the Al doping in the anatase TiO2 did not notably increase the conduction band offset even with a higher Al concentration. The detailed analyses of the leakage conduction mechanism based on the quantum mechanical transfer-matrix method showed that Schottky emission and Fowler-Nordheim tunneling was the dominant leakage conduction mechanism in the lower and higher voltage regions, respectively. The chemical analyses using X-ray photoelectron spectroscopy corroborated the electrical test results.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Semiconductor materials and devices · Advanced Memory and Neural Computing · Electronic and Structural Properties of Oxides

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Materials Science and Engineering and Inter-university Semiconductor Research Center, Seoul National University, Seoul 151-742, Republic of Korea

Process Development Team, Semiconductor R&D Center, Samsung Electronics Co. Ltd., Gyeonggi-do 446-712, Republic of Korea

MEIS Dev. Team, Korea Materials & Analysis Corp., 554, Yongsan-Dong, Yusung-Gu, Daejeon 305-500, Republic of Korea

Electronic Materials Research Center, Korea Institute of Science and Technology, Seoul 136-791, Republic of Korea

References (36)

Show source-provided references
1. Kim S. K. · Adv. Funct. Mater. · 2010 · 20 · 298910.1002/adfm.201000599 ↗
2. Hwang, C. S.Atomic Layer Deposition of Nanostructured Materials: Atomic Layer Deposition for Microelectronic Applications;Wiley-VCH Verlag GmbH & Co. KGaA:Weinheim, Germany, 2011; pp159–192.10.1002/9783527639915.ch8 ↗
3. Hwang C. S. · 201410.1007/978-1-4614-8054-9 ↗
4. Robertson J. · J. Vac. Sci. Technol. B · 2000 · 18 · 178510.1116/1.591472 ↗
5. Cho, H. J.; Kim, Y. D.; Park, D. S.; Lee, E.; Park, C. H.; Jang, J. S.; Lee, K. B.; Kim, H. W.; Chae, S. J.; Ki, Y. J.; Han, I. K.; Song, Y. W.New TIT Capacitor with ZrO2/Al2O3/ZrO2Dielectrics for 60nm and below DRAMs,Proceeding of the 36th European Solid-State Device Research Conference (ESSDERC), Montreux, Switzerland, Sept. 19–21, 2006; Institute of Electrical and Electronics Engineers:New York, 2006.10.1109/ESSDER.2006.307659 ↗
6. Kil, D.S.; Song, H.S.; Lee, K.J.; Hong, K.; Kim, J.H.; Park, K.S.; Yeom, S.J.; Roh, J.S.; Kwak, N.J.; Sohn, H.C.; Kim, J.W.; Park, S.W.Development of New TiN/ZrO2/Al2O3/ZrO2/TiN Capacitors Extendable to 45nm Generation DRAMs Replacing HfO2Based Dielectrics,Symposium on VLSI Technology, Honolulu, USA, June 13–15, 2006.10.1109/VLSIT.2006.1705205 ↗
7. Kim S. K. · Adv. Mater. · 2008 · 20 · 142910.1002/adma.200701085 ↗
8. Han J. H. · Chem. Mater. · 2008 · 21 · 20710.1021/cm802485r ↗
9. Han J. H. · Chem. Mater. · 2010 · 22 · 570010.1021/cm101694g ↗
10. Choi G.-J. · J. Electrochem. Soc. · 2009 · 156 · G13810.1149/1.3169516 ↗
11. Kim S. K. · Appl. Phys. Lett. · 2004 · 85 · 411210.1063/1.1812832 ↗
12. Han J. H. · Appl. Phys. Lett. · 2011 · 99 · 02290110.1063/1.3609875 ↗
13. Seo M. · J. Appl. Phys. · 2011 · 110 · 02410510.1063/1.3605527 ↗
14. Zhou D. · J. Appl. Phys. · 2010 · 108 · 12410410.1063/1.3520666 ↗
15. Ding S.-J. · Appl. Phys. Lett. · 2005 · 87 · 05350110.1063/1.2005397 ↗
16. Kukli K. · J. Mater. Sci.: Mater. Electron. · 2003 · 14 · 361
17. Suzuki R. · Appl. Phys. Lett. · 2012 · 100 · 13290610.1063/1.3698095 ↗
18. Ahn J. · Appl. Phys. Lett. · 2011 · 99 · 23290210.1063/1.3662966 ↗
19. Jeon W. · Electrochem. Solid-State Lett. · 2008 · 11 · H1910.1149/1.2813881 ↗
20. Jõgi I. · J. Appl. Phys. · 2007 · 102 · 11411410.1063/1.2822460 ↗
21. Kim Y. S. · J. Cryst. Growth · 2005 · 274 · 58510.1016/j.jcrysgro.2004.10.007 ↗
22. Lee W. · J. Mater. Chem. · 2012 · 22 · 1503710.1039/c2jm31897k ↗
23. Rowlette P. C. · Thin Solid Films · 2010 · 518 · 333710.1016/j.tsf.2009.10.136 ↗
24. Kim H. K. · ACS Appl. Mater. Interfaces · 2013 · 5 · 132710.1021/am302604e ↗
25. Kim S. K. · Chem. Mater. · 2008 · 20 · 372310.1021/cm800280t ↗
26. Escudero A. · Am. Mineral. · 2012 · 97 · 107510.2138/am.2012.4049 ↗
27. Shin J. C. · J. Appl. Phys. · 1999 · 86 · 50610.1063/1.370759 ↗
28. Hwang C. S. · J. Appl. Phys. · 1999 · 85 · 243110.1063/1.369562 ↗
29. Rose A. · Phys. Rev. · 1955 · 97 · 153810.1103/PhysRev.97.1538 ↗
30. Jonsson B. · IEEE J. Quantum Electron. · 1990 · 26 · 202510.1109/3.62122 ↗
31. Tsu R. · Appl. Phys. Lett. · 1973 · 22 · 56210.1063/1.1654509 ↗
32. He J. · Acta Mater. · 2007 · 55 · 432510.1016/j.actamat.2007.04.005 ↗
33. Janotti A. · Phys. Rev. B · 2010 · 81 · 08521210.1103/PhysRevB.81.085212 ↗
34. Deák P. · Phys. Rev. B · 2011 · 83 · 15520710.1103/PhysRevB.83.155207 ↗
35. Tang H. · Phys. Rev. B · 1995 · 52 · 777110.1103/PhysRevB.52.7771 ↗
36. Di Valentin C. · J. Phys. Chem. C · 2009 · 113 · 2054310.1021/jp9061797 ↗