journal article·2017-05-17

Ionic Gel Paper with Long-Term Bendable Electrical Robustness for Use in Flexible Electroluminescent Devices

Minghui He, Kaili Zhang, Guangxue Chen, Junfei Tian, Bin Su

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Abstract

Conductive paper has low-cost, lightweight, sustainability, easy scale-up, and tailorable advantages, allowing for its promising potential in flexible electronics, such as bendable supercapacitors, solar cells, electromagnetic shields, and actuators. Ionic gels, exhibiting a lower Young’s modulus together with facile manufacturing, can fully serve as the conductive component to prepare conductive paper. Herein we report a low-cost (∼1.3 dollars/m 2 ), continuous, and high-throughput (up to ∼30 m/min) fabrication of reliable and long-term (stable for more than two months) conductive paper. As-prepared conductive paper shows a high electrical durability with negligible bending–recovering signal changes over 5000 cycles. Using this ionic gel paper (IGP) as a key component, we build a variety of proof-of-principle demonstrations to show the capacity of IGP in constructing flexible electroluminescent devices with diverse patterns, including a square, an alphabetic string, and a laughing face. Our methodology has the potential to open a new powerful route to fabricate bendable conductive paper for a myriad of applications in future flexible electronics.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Biosensors and Analytical Detection · Electrowetting and Microfluidic Technologies · Advanced Sensor and Energy Harvesting Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

State Key Laboratory of Pulp & Paper Engineering, South China University of Technology, Guangzhou 510640, Guangdong, PR China

Department of Chemical Engineering, Monash University, Clayton, Victoria 3800, Australia

Funding

Australian Research Council · National Natural Science Foundation of China · State Key Laboratory of Pulp and Paper Engineering, South China University of Technology

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