journal article·2016-07-06

Patterned Peeling 2D MoS2 off the Substrate

Jing Zhao, Hua Yu, Wei Chen, Rong Yang, Jianqi Zhu, Mengzhou Liao, Dongxia Shi, Guangyu Zhang

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Abstract

The performance of two-dimensional (2D) MoS2 devices depends largely on the quality of the MoS2 itself. Existing fabrication process for 2D MoS2 relies on lithography and etching. However, it is extremely difficult to achieve clean patterns without any contaminations or passivations. Here we report a peel-off pattering of MoS2 films on substrates based on a proper interface engineering. The peel-off process utilizes the strong adhesion between gold and MoS2 and removes the MoS2 film contact with gold directly, leading to clean MoS2 pattern generation without residuals. Significantly improved electrical performances including high mobility ∼17.1 ± 8.3 cm(2)/(V s) and on/off ratio ∼5.6 ± 3.6 × 10(6) were achieved. Such clean fabrication technique paves a way to high quality MoS2 devices for various electrical and optical applications.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: 2D Materials and Applications · Graphene research and applications · MXene and MAX Phase Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Beijing National Laboratory for Condensed Matter Physics and Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China

Beijing Institute of Nanoenergy and Nanosystems, Chinese Academy of Sciences, Beijing 100083, China

College of Physics and Electronic Information, Gannan Normal University, Ganzhou, Jiangxi 341000, China

Collaborative Innovation Center of Quantum Matter, Beijing 100190, China

Beijing Key Laboratory for Nanomaterials and Nanodevices, Beijing 100190, China

Funding

Ministry of Science and Technology of the People's Republic of China · National Natural Science Foundation of China · Natural Science Foundation of Jiangxi Province · Chinese Academy of Sciences · Jiangxi Provincial Department of Education

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