Source abstract
Abstract
Flexible thermoelectric materials that can harvest waste heat energy have attracted great attention because of the rapid progress of flexible electronics. Ag2Te nanowires (Ag2Te NWs) are considered as promising thermoelectric materials to fabricate flexible thermoelectric film and device because of their high Seebeck coefficient, but poor contact between the Ag2Te NWs results in low electrical conductivity. Generally, hot or cold pressing can increase the electrical conductivity between the Ag2Te NWs. However, these process tend to destroy the initial morphology of the Ag2Te NWs and/or cause only physical contact between the Ag2Te NWs. Herein, we report an approach to the room-temperature welding of Ag2Te NWs to enhance their contacts by facile combination of vacuum filtration and drop-coating methods. The obtained Ag2Te NWs film exhibits excellent Seebeck coefficient of −99.48 μV/K and high electrical conductivity of 15 335.05 S/m at room temperature, which gives the power factor of 151.76 μW m–1 K–2. Surprisingly, an optimal Seebeck coefficient of −154.96 μV/K and electrical conductivity of 14 982.42 S/m can be obtained at 420 K, giving a power factor of 359.76 μW m–1 K–2. Moreover, the electrical resistance of the Ag2Te NWs film was only 1.3 times of the initial electrical resistance after 1000 bending cycles, indicating good flexibility of the film. A finger-touch test is conducted by using the Ag2Te NWs film as thermoelectric power generator, which achieves a stable output voltage of about 0.52 mV, suggesting its great potential applications in self-powered flexible electronic devices.
Source: openalex_inverted_index · Quality: baseline
Affiliations
Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China
School of Materials Science and Engineering, Nanchang University, Nanchang 330031, China
Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences, Shenzhen 518055, China
Department of Electronics Engineering, The Chinese University of Hong Kong, Kowloon, Hong Kong 999077, China
School of Materials Science and Engineering, Georgia Institute of Technology, Atlanta, Georgia 30332, United States
Funding
National Natural Science Foundation of China · Chinese Academy of Sciences · National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials · Joint Laboratory of Materials and Devices for High Density Electronic Packaging · Shenzhen Municipality