journal article·2018-03-21

Three-Dimensional Graphene Structure for Healable Flexible Electronics Based on Diels–Alder Chemistry

Jinhui Li, Qiang Liu, Derek Ho, Songfang Zhao, Shuwen Wu, Lei Ling, Fei Han, Xinxiu Wu, Guoping Zhang, Rong Sun, Ching-Ping Wong

ACS Applied Materials & Interfaces· Volume 10· Issue 11
Publisher page

Abstract

Wearable electronics with excellent stretchability and sensitivity have emerged as a very promising field with wide applications such as e-skin and human motion detection. Although three-dimensional (3D) graphene structures (GS) have been reported for high-performance strain sensors, challenges still remain such as the high cost of GS preparation, low stretchability, and the lack of ability to heal itself. In this paper, we reported a novel self-healing flexible electronics with 3D GS based on Diels-Alder (DA) chemistry. Furfurylamine (FA) was employed as a reducing as well as a modifying agent, forming GS by FA (FAGS)/DA bonds contained polyurethane with the "infiltrate-gel-dry" process. The as-prepared composite exhibited excellent stretchability (200%) and intrinsic conductivity with low incorporation of graphene (about 2 wt %), which could be directly employed for flexible electronics to detect human motions. Besides, the FAGS/DAPU composite exhibited lower temperature retro-DA response for the continuous graphene networks. Highly effective healing of the composites by heat and microwave has been demonstrated successfully.
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Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Conducting polymers and applications · Polydiacetylene-based materials and applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

Department of Materials Science and Engineering, City University of Hong Kong, 83 Tat Chee Avenue, Kowloon Hong Kong 999077, China

School of Material Science and Engineering, University of Jinan, Jinan 250022, China

Department of Electronic Engineering, The Chinese University of Hong Kong, Shatin, N.T., Hong Kong 999077, China

Funding

Research Grants Council, University Grants Committee · Government of Guangdong Province · National Natural Science Foundation of China · Natural Science Foundation of Guangdong Province · Shenzhen Institutes of Advanced Technology, Chinese Academy Sciences · Key Laboratory of Guangdong Province · Shenzhen Municipality · Shenzhen Science, Technology and Innovation Commission

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