journal article·2014-01-08

Crack-Free and Scalable Transfer of Carbon Nanotube Arrays into Flexible and Highly Thermal Conductive Composite Film

Miao Wang, Hongyuan Chen, Wei Lin, Zhuo Li, Qiang Li, Minghai Chen, Fancheng Meng, Yajuan Xing, Yagang Yao, Ching-ping Wong, Qingwen Li

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Abstract

Carbon nanotube (CNT) arrays show great promise in developing anisotropic thermal conductive composites for efficiently dissipating heat from high-power devices along thickness direction. However, CNT arrays are always grown on some substrates and liable to be deformed and broken into pieces during transfer and solution treatment. In the present study, we intentionally synthesized well-crystallized and large-diameter (~80 nm) multiwalled CNT (MWCNT) arrays by floating catalyst chemical vapor deposition (FCCVD) method. Such arrays provided high packing density and robust structure from collapse and crack formation during post solution treatment and therefore favored to maintain original thermal and electrical conductive paths. Under optimized condition, the CNT arrays can be transferred into flexible composite films. Furthermore, the composite film also exhibited excellent thermal conductivity at 8.2 W/(m·K) along thickness direction. Such robust, flexible, and highly thermal conductive composite film may enable some prospective applications in advanced thermal management.
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Research context

OpenAlex topics: Thermal properties of materials · Carbon Nanotubes in Composites · Thermal Radiation and Cooling Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Power and Energy Engineering, Nanjing University of Science and Technology, Nanjing 210094, China

Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences, Suzhou 215123, China

School of Materials Science and Engineering, Georgia Institute of Technology, 771 Ferst Drive, Atlanta 30332, United States

Department of Electronic Engineering, Faculty of Engineering, The Chinese University of Hong Kong, ShaTin, Hong Kong

References (49)

Show source-provided references
1. Chowdhury I. · Nat. Nanotechnol. · 2009 · 4 · 23510.1038/nnano.2008.417 ↗
2. Dutta I. · Electron. Mater. · 2009 · 38 · 273510.1007/s11664-009-0898-9 ↗
3. Carlberg B. · Microelectron. Int. · 2009 · 26 · 2810.1108/13565360910960213 ↗
4. Fujii M. · Phys. Rev. Lett. · 2005 · 95 · 06550210.1103/PhysRevLett.95.065502 ↗
5. Pop E. · Nano Lett. · 2006 · 6 · 9610.1021/nl052145f ↗
6. Balandin A. A. · Nat. Mater. · 2011 · 10 · 56910.1038/nmat3064 ↗
7. Yu C. · Nano Lett. · 2005 · 5 · 184210.1021/nl051044e ↗
8. Xu Y. · Electron. Mater. · 2007 · 36 · 118110.1007/s11664-007-0188-3 ↗
9. Nanda J. · J. Phys. Chem. · 2008 · 112 · 654
10. Bieruck M. J. · Appl. Phys. Lett. · 2002 · 80 · 276710.1063/1.1469696 ↗
11. Liu C. H. · Appl. Phys. Lett. · 2004 · 84 · 424810.1063/1.1756680 ↗
12. Haggenmueller R. · Macromolecules · 2007 · 40 · 241710.1021/ma0615046 ↗
13. Li Q. · Nano Lett. · 2009 · 9 · 380510.1021/nl901988t ↗
14. Han Z. · Prog. Polym. Sci. · 2011 · 36 · 91410.1016/j.progpolymsci.2010.11.004 ↗
15. Endo M. · Nature. · 2005 · 433 · 47610.1038/433476a ↗
16. Poggi M. A. · Chem. Mater. · 2005 · 17 · 428910.1021/cm048346m ↗
17. Gou J. H. · Polym. Int. · 2006 · 55 · 128310.1002/pi.2079 ↗
18. Zheng F. · Anal. Chem. · 2006 · 78 · 244210.1021/ac051524q ↗
19. Chen H. · J. Phys. Chem. · 2012 · 116 · 3903
20. Wang D. · Nanotechnology · 2008 · 19 · 07560910.1088/0957-4484/19/7/075609 ↗
21. Gonnet P. · Curr. Appl. Phys. · 2006 · 6 · 11910.1016/j.cap.2005.01.053 ↗
22. Xie H. J. · Mater. Sci. · 2007 · 42 · 369510.1007/s10853-007-1707-6 ↗
23. Aliev A. E. · Nanotechnology · 2010 · 21 · 03570910.1088/0957-4484/21/3/035709 ↗
24. Cross R. · Nanotechnology · 2010 · 21 · 570510.1088/0957-4484/21/44/445705 ↗
25. Xu J. · IEEE Trans. Compon. Packag. Technol. · 2006 · 29 · 26110.1109/TCAPT.2006.875876 ↗
26. Panzer M. A. · J. Heat Transfer · 2008 · 130 · 05240110.1115/1.2885159 ↗
27. Maklin J. · Phys. Status Solidi B · 2011 · 248 · 250810.1002/pssb.201100143 ↗
28. Shaikh S. · Carbon · 2007 · 45 · 260810.1016/j.carbon.2007.08.011 ↗
29. Xie H. · Phys. Lett. A · 2007 · 369 · 12010.1016/j.physleta.2007.02.079 ↗
30. Akoshima M. · Jpn. J. Appl. Phys. · 2009 · 48 · 05EC0710.1143/JJAP.48.05EC07 ↗
31. Yang D. · Phys. Lett. A. · 2002 · 329 · 20710.1016/j.physleta.2004.05.070 ↗
32. Huang H. · Adv. Mater. · 2005 · 17 · 165210.1002/adma.200500467 ↗
33. Lin W. · Adv. Mater. · 2009 · 21 · 242110.1002/adma.200803548 ↗
34. Marconnet A. M. · ACS Nano · 2011 · 5 · 481810.1021/nn200847u ↗
35. Xu H. M. · Chinese J. Inorg. Chem. · 2005 · 21 · 1353
36. Akoshima M. · Jpn. J. Appl. Phys. · 2009 · 48 · 05EC0710.1143/JJAP.48.05EC07 ↗
37. Andrews R. · Chem. Phys. Lett. · 1999 · 303 · 46710.1016/S0009-2614(99)00282-1 ↗
38. Chen L. · ACS Nano · 2012 · 6 · 1088410.1021/nn304310n ↗
39. Liu Z. · Nano Lett. · 2013 · 13 · 402810.1021/nl401097d ↗
40. Huang S. · Adv. Mater. · 2011 · 23 · 470710.1002/adma.201102472 ↗
41. Li L. · Adv. Mater. · 2011 · 23 · 373010.1002/adma.201101862 ↗
42. Huang S. · J. Mater. Chem. · 2012 · 22 · 1620910.1039/c2jm33009a ↗
43. Sun X. · Acc. Chem. Res. · 2013 · 46 · 53910.1021/ar300221r ↗
44. Singh C. · Chem. Phys. Lett. · 2003 · 372 · 86010.1016/S0009-2614(03)00531-1 ↗
45. Ivanov I. · Appl. Phys. Lett. · 2006 · 89 · 22311010.1063/1.2397008 ↗
46. Zhang Q. · Appl. Phys. A: Mater. Sci. Process. · 2009 · 94 · 85310.1007/s00339-008-4904-5 ↗
47. Akoshima M. · Jpn. J. Appl. Phys. · 2009 · 48 · 05EC0710.1143/JJAP.48.05EC07 ↗
48. Yang W. P. · Mater. Rev. · 2011 · 25 · 394
49. Bin Y. · Macromolecules · 2003 · 36 · 621310.1021/ma0301956 ↗