High-Performance Dispenser Printed MA p-Type Bi0.5Sb1.5Te3 Flexible Thermoelectric Generators for Powering Wireless Sensor Networks
Source abstract
Abstract
This work presents a novel method to synthesize p-type composite thermoelectric materials to print scalable thermoelectric generator (TEG) devices in a cost-effective way. A maximum ZT of 0.2 was achieved for mechanically alloyed (MA) p-type Bi0.5Sb1.5Te3 (8 wt % extra Te additive)-epoxy composite films cured at 250 °C. A 50% increase in Seebeck coefficient as a result of adding 8 wt % extra Te in stoichiometric Bi0.5Sb1.5Te3 contributed to the increase in ZT. To demonstrate cost-effective and scalable manufacturing, we fabricated a sixty element thermoelectric generator prototype with 5.0 mm × 600 μm × 120 μm printed dimensions on a custom designed polyimide substrate with thick metal contacts. The prototype TEG device produced a power output of 20.5 μW at 0.15 mA and 130 mV for a temperature difference of 20 K resulting in a device areal power density of 152 μW/cm(2). This power is sufficient for low power applications such as wireless sensor network (WSN) devices.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Thermoelectric Materials and Devices · Thermal Radiation and Cooling Technologies · Innovative Energy Harvesting Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Mechanical Engineering and ‡Department of Materials Science and Engineering, University of California, Berkeley, California 94720, United States
References (32)
Show source-provided references
1. Goldsmid H. J. · Br. J. Appl. Phys. · 1954 · 5 · 38610.1088/0508-3443/5/11/303 ↗
2. Glatz W. · Sens. Actuators, A · 2006 · 132 · 33710.1016/j.sna.2006.04.024 ↗
3. Strasser M. · Sens. Actuators, A · 2004 · 114 · 36210.1016/j.sna.2003.11.039 ↗
4. Rowe D. M. · 2005
5. Majumdar A. · Science · 2004 · 303 · 77710.1126/science.1093164 ↗
6. Koplow M. · 2008
7. Chen A. · J. Micromech. Microeng. · 2011 · 21 · 10400610.1088/0960-1317/21/10/104006 ↗
8. http://ei.haas.berkeley.edu/c2m/pdf/2011EndofYearSlides/ThermoelectricMaterial.pdfAccessed Oct. 6, 2013.
9. Weber J. · Sens. Actuators, A · 2006 · 132 · 32510.1016/j.sna.2006.04.054 ↗
10. Zhang B. · ACS Appl. Mater. Interfaces · 2010 · 2 · 317010.1021/am100654p ↗
11. See K. C. · Nano Lett. · 2010 · 10 · 466410.1021/nl102880k ↗
12. Ho C. C. · J. Micromech. Microeng. · 2010 · 20 · 10400910.1088/0960-1317/20/10/104009 ↗
13. Madan D. · J. Electron. Mater. · 2012 · 41 · 148110.1007/s11664-011-1885-5 ↗
14. Chen A. · 2009
15. Poudel B. · Science · 2008 · 320 · 63410.1126/science.1156446 ↗
16. Venkatasubramanian R. · Nature · 2001 · 413 · 59710.1038/35098012 ↗
17. Miller G. R. · J. Phys. Chem. Solids · 1965 · 26 · 17310.1016/0022-3697(65)90084-3 ↗
18. Ha H. P. · J. Phys. Chem. Solids · 1994 · 55 · 123310.1016/0022-3697(94)90204-6 ↗
19. Yim W. M. · Solid-State Electron. · 1972 · 15 · 112110.1016/0038-1101(72)90172-4 ↗
20. Yim W. · J. Mater. Sci. · 1966 · 1 · 5210.1007/BF00549720 ↗
21. Hyun D. B. · J. Mater. Sci. · 2001 · 36 · 128510.1023/A:1004862700211 ↗
22. Madan D. · J. Appl. Phys. · 2011 · 109 · 03490410.1063/1.3544501 ↗
23. Madan D. · ACS Appl. Mater. Interfaces · 2012 · 4 · 611710.1021/am301759a ↗
24. Wang Z. · J. Micromech. Microeng. · 2012 · 22 · 09400110.1088/0960-1317/22/9/094001 ↗
25. Lu D. · IEEE Trans. Electron. Packag. Manuf. · 1999 · 22 · 22310.1109/6104.795857 ↗
26. Lu D. · IEEE Trans. Electron. Packag. Manuf. · 2000 · 23 · 18510.1109/6104.873246 ↗
27. Lu D. · Inter. J. Adhes. Adhes. · 2000 · 20 · 18910.1016/S0143-7496(99)00039-1 ↗
28. Mclachlan D. S. · J. Am. Ceram. Soc. · 1990 · 73 · 218710.1111/j.1151-2916.1990.tb07576.x ↗
29. Nan C. W. · Prog. Mater. Sci. · 1993 · 37 · 110.1016/0079-6425(93)90004-5 ↗
30. Zhao L. D. · J. Alloys Compd. · 2009 · 467 · 9110.1016/j.jallcom.2007.12.063 ↗
31. Liu Y. H. · J. Am. Ceram. Soc. · 2005 · 88 · 133710.1111/j.1551-2916.2005.00284.x ↗
32. Zhao L. D. · J. Appl. Phys. · 2009 · 105 · 02370410.1063/1.3063694 ↗