High-Performance Skutterudite/Half-Heusler Cascaded Thermoelectric Module Using the Transient Liquid Phase Sintering Joining Technique
Source abstract
Abstract
Thermoelectric (TE) materials have made rapid advancement in the past decade, paving the pathway toward the design of solid-state waste heat recovery systems. The next requirement in the design process is realization of full-scale multistage TE devices in the medium to high temperature range for enhanced power generation. Here, we report the design and manufacturing of full-scale skutterudite (SKD)/half-Heusler (hH) cascaded TE devices with 49-couple TE legs for each stage. The automated pick-and-place tool is employed for module fabrication providing overall high manufacturing process efficiency and repeatability. Optimized Ti/Ni/Au coating layers are developed for metallization as the diffusion barrier and electrode contact layers. The Cu–Sn transient liquid phase sintering technique is utilized for SKD and hH stages, which provides a high strength bonding and very low contact resistance. A remarkably high output power of 38.3 W with a device power density of 2.8 W·cm –2 at a temperature gradient of 513 °C is achieved. These results provide an avenue for widespread utilization of TE technology in waste heat recovery applications.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Thermoelectric Materials and Devices · Heusler alloys: electronic and magnetic properties · Thermal Expansion and Ionic Conductivity
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Materials Science and Engineering, Pennsylvania State University, University Park, Pennsylvania16802, United States
Electronics and Applied Physics Division, RTI International, Research Triangle Park, North Carolina27709, United States
Funding
Defense Advanced Research Projects Agency · Basic Energy Sciences · Advanced Research Projects Agency - Energy · Office of Naval Research · Army Research Laboratory · U.S. Army · National Science Foundation
References (58)
Show source-provided references
1. U.S. Energy Information Administration; Today in Energy. https://www.eia.gov/todayinenergy/detail.php?id=32912 (accessed September 28, 2021).
2. 10.1016/j.enconman.2017.02.07010.1016/j.enconman.2017.02.070 ↗
3. 10.1088/0034-4885/51/4/00110.1088/0034-4885/51/4/001 ↗
4. El-Genk, M. S.; Saber, H. H. Handbook of Thermoelectrics: Micro to Nano. Rowe, D. M., Ed. Taylor & Francis Group: Boca Raton, FL, 2006; pp 8–9.
5. 10.1002/adem.20150033310.1002/adem.201500333 ↗
6. 10.1126/science.115644610.1126/science.1156446 ↗
7. 10.1021/acsami.8b2152410.1021/acsami.8b21524 ↗
8. 10.1021/jacs.9b0096710.1021/jacs.9b00967 ↗
9. 10.1016/j.isci.2020.10134010.1016/j.isci.2020.101340 ↗
10. 10.1021/acs.chemmater.8b0399410.1021/acs.chemmater.8b03994 ↗
11. 10.1016/j.nanoen.2019.10419310.1016/j.nanoen.2019.104193 ↗
12. 10.1021/ja111199y10.1021/ja111199y ↗
13. 10.1016/j.mattod.2020.01.00210.1016/j.mattod.2020.01.002 ↗
14. 10.1016/j.nanoen.2012.07.02010.1016/j.nanoen.2012.07.020 ↗
15. 10.1002/aenm.20140060010.1002/aenm.201400600 ↗
16. Li W. · Adv. Mater. · 2022
17. Zhu H. · Nat. Commun. · 2022
18. 10.1021/acsami.9b1360710.1021/acsami.9b13607 ↗
19. 10.1002/adma.20100478210.1002/adma.201004782 ↗
20. 10.1038/nature0163910.1038/nature01639 ↗
21. 10.1021/acsami.1c1611710.1021/acsami.1c16117 ↗
22. 10.1021/acsami.9b1482310.1021/acsami.9b14823 ↗
23. 10.1039/C6EE02017H10.1039/C6EE02017H ↗
24. 10.3390/en1222429210.3390/en12224292 ↗
25. 10.1016/j.nanoen.2017.10.00310.1016/j.nanoen.2017.10.003 ↗
26. 10.1039/C9EE03410B10.1039/C9EE03410B ↗
27. 10.1039/D0EE90029J10.1039/D0EE90029J ↗
28. 10.1126/sciadv.abf273810.1126/sciadv.abf2738 ↗
29. 10.1016/j.jpowsour.2021.22969510.1016/j.jpowsour.2021.229695 ↗
30. 10.1016/j.joule.2020.08.00910.1016/j.joule.2020.08.009 ↗
31. 10.1039/C9EE02228G10.1039/C9EE02228G ↗
32. 10.1098/rsta.2018.045010.1098/rsta.2018.0450 ↗
33. Bultitude J. · 2020
34. 10.3389/fmats.2021.65846410.3389/fmats.2021.658464 ↗
35. 10.1002/aenm.20200192410.1002/aenm.202001924 ↗
36. 10.1039/C7EE00447H10.1039/C7EE00447H ↗
37. 10.1039/C5EE02979A10.1039/C5EE02979A ↗
38. 10.1103/PhysRevLett.91.14830110.1103/PhysRevLett.91.148301 ↗
39. 10.1016/j.jpowsour.2017.08.09110.1016/j.jpowsour.2017.08.091 ↗
40. 10.1016/j.apenergy.2017.11.09610.1016/j.apenergy.2017.11.096 ↗
41. 10.1016/j.apenergy.2017.06.10810.1016/j.apenergy.2017.06.108 ↗
42. 10.1002/aenm.20150058810.1002/aenm.201500588 ↗
43. 10.1038/ncomms914410.1038/ncomms9144 ↗
44. 10.1002/aenm.20200088810.1002/aenm.202000888 ↗
45. 10.1021/acsaem.8b0006410.1021/acsaem.8b00064 ↗
46. 10.1007/s11664-012-1958-010.1007/s11664-012-1958-0 ↗
47. 10.1007/s11664-015-4022-z10.1007/s11664-015-4022-z ↗
48. 10.1007/s11664-009-1048-010.1007/s11664-009-1048-0 ↗
49. 10.1007/s11664-014-3020-x10.1007/s11664-014-3020-x ↗
50. 10.1063/5.008812910.1063/5.0088129 ↗
51. 10.1038/srep2412310.1038/srep24123 ↗
52. Aasmundtveit, K. E.; Luu, T.T.; Wang, K.; Hoivik, N. Void formation in Cu-Sn Solid-Liquid Interdiffusion (SLID) bonding. In 2015 European Microelectronics Packaging Conference (EMPC); IEEE, 2015; pp 1–6.10.1109/DTIP.2016.7514894 ↗
53. 10.3390/app709095210.3390/app7090952 ↗
54. 10.1016/j.surfcoat.2015.11.05710.1016/j.surfcoat.2015.11.057 ↗
55. 10.1021/acsami.0c0841310.1021/acsami.0c08413 ↗
56. 10.1088/0957-0233/27/10/10500810.1088/0957-0233/27/10/105008 ↗
57. 10.1038/s41467-019-09707-810.1038/s41467-019-09707-8 ↗
58. 10.1021/acsami.9b2129910.1021/acsami.9b21299 ↗