Controlling the Morphology of Dynamic Thia-Michael Networks to Target Pressure-Sensitive and Hot Melt Adhesives
Source abstract
Abstract
A series of multistage (pressure-sensitive/hot melt) adhesives utilizing dynamic thia-Michael bonding motifs are reported. The benzalcyanoacetate Michael acceptors used in this work undergo bond exchange under ambient conditions without external catalysis, facilitating pressure-sensitive adhesion. A key feature of this system is the dynamic reaction-induced phase separation that lends reinforcement to the otherwise weakly bonded materials, enabling weak, repeatable pressure-sensitive adhesion under ambient conditions and strong adhesion when processed as a hot melt adhesive. By using different pairs of benzalcyanoacetate cross-linking units, the phase separation characteristics of the adhesives can be directly manipulated, allowing for a tailored adhesive response.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Polymer composites and self-healing · Polydiacetylene-based materials and applications · Luminescence and Fluorescent Materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Pritzker School of Molecular Engineering, University of Chicago, Chicago, Illinois 60637, United States
Department of Chemistry, University of Chicago, Chicago, Illinois 60637, United States
James Franck Institute, University of Chicago, Chicago, Illinois 60637, United States
Chemical Science and Engineering Division and Center for Molecular Engineering, Argonne National Laboratory, 9700 S. Cass Avenue, Lemont, Illinois 60434, United States
Funding
National Institute of Standards and Technology · Division of Materials Research
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