Electrospun Elastic Films Containing AgNW-Bridged MXene Networks as Capacitive Electronic Skins

Electronic skins (e-skins) are increasingly investigated and applied in wearable devices, but the robustness and convenient production of traditional e-skins are restricted. In this work, electrospun sandwich-structured elastic films (ESEFs) are developed and utilized as capacitive e-skins. The ESEFs consist of two nanocomposite mats as the electrode layers and a sandwiched thermoplastic polyurethane (TPU) mat as the dielectric layer. The nanocomposite mats are composed of thermoplastic polyurethane (TPU) and AgNW-bridged MXene (AgNW, silver nanowire; MXene, Ti3C2Tx) conductive network. The resulting ESEFs achieve a tensile strength of 14.80 MPa, an elongation at break of 270%, and an outstanding antifatigue property. E-skins of such ESEFs have the ability to respond to both strain and pressure with a high gauge factor (GF) (strain: GF = 1.21; pressure: GF = 0.029 kPa–1), wide response range (strain: 0–150%; pressure: 0–70 kPa), low response time, and outstanding stability (2000 cycles). On the basis of integrated sensing performances, such e-skins are further applied in monitoring various mechanical stimuli in daily life, including bending of a plastic plate, joint bending, and swallowing.