Source abstract
Abstract
To date, various electronic devices have been strategically fabricated, and simultaneous realization of high electrical conductivity, sensing property, and heat-conducting property by a simple, efficient, and accurate approach is significant but still challenging. Here, cellulosic fiber supported 3D interconnected silver nanowire (AgNW) networks with hierarchical structures are rationally designed to achieve excellent electrical conductivity and superior thermal dispersion capability. In particular, thermal annealing at the junctions enables both phonon and electron transfer as well as impedes interfacial slippage. In the current study, the AgNW/cellulosic paper with the low Ag content (1.55 wt %) exhibits a low sheet resistance of 0.51 Ω sq–1. More importantly, the AgNW/cellulosic paper-based flexible strain sensor has been reasonably developed, which can be applied to monitor various microstructural changes and human motions with high sensitivity and robust stability (fast response/relaxation time of ∼100 ms and high stability >2000 bending–stretching cycles). The AgNW/cellulosic paper-based device also displays efficient thermal dispersion property, which offers exciting opportunities for thermal management application. Furthermore, the obtained hybrid paper exhibits superior heat dispersion capacity for thermal management devices. Overall, uniform dispersion and 3D interconnected junctions of AgNW among the fibers inside the cellulosic papers lead to the combination of high mechanical strength, highly efficient electrical conductivity, and ultrahigh heat dispersion property. The AgNW/cellulosic paper has promising potentials in the flexible and wearable sensing elements, thermal management materials, and artificial intelligence devices.
Source: openalex_inverted_index · Quality: baseline
Affiliations
Plant Fiber Research Center, State Key Laboratory of Pulp and Paper Engineering, School of Light Industry and Engineering, South China University of Technology, Guangzhou 510640, P. R. China
SDIC Biotech Investment CO., Ltd., No. 147, Xizhimen Street, Xicheng District, Beijing 100034, P. R. China
Department of Food Science and Engineering, Jinan University, Guangzhou 510632, P. R. China
Funding
Ministry of Education of the People's Republic of China · Ministry of Science and Technology of the People's Republic of China · China Postdoctoral Science Foundation · State Key Laboratory of Pulp and Paper Engineering · National Natural Science Foundation of China · Guangdong provincial science & technology plan projects