journal article·2022-02-02

Lightweight and Highly Compressible Expandable Polymer Microsphere/Silver Nanowire Composites for Wideband Electromagnetic Interference Shielding

Jianhong Wei, Zhiqiang Lin, Zuomin Lei, Yadong Xu, Zeyu Zhao, Tao Zhao, Yougen Hu, Hua Miao, Rong Sun

Publisher page

Abstract

The exploration of lightweight and compressible electromagnetic interference (EMI) shielding materials with outstanding shielding effectiveness (SE) is still a tremendous challenge in the elimination of electromagnetic pollution. Lightweight and highly compressible expandable polymer microsphere/silver nanowire (EPM/AgNW) composites with micron-sized closed pores and an interfacial AgNW conductive network are fabricated via a facile thermal expansion process in an enclosed space. The EPM/AgNW composites with AgNW loading of 0.127 vol % show low density (0.061 g/cm3), high compressibility and compression strength (4.25 MPa at 92.6% of compressive strain), and high EMI SE (over 40 dB, 1 mm) at a wideband of 8–40 GHz. Their EMI SE can be improved to a record 111.5 dB by increasing the AgNW content to 0.340 vol %, which corresponds to the surface-specific SE (SSE/d; SE divided by density and thickness) up to 13433 dB·cm2/g. The EMI shielding mechanism is further discussed using the finite-element analysis software COMSOL Multiphysics, and the application of the EPM/AgNW composites is visually demonstrated via near-field shielding in a practical antenna radiation. The overall properties of light weight, high elasticity, excellent mechanical strength, and outstanding EMI shielding performance suggest that the as-prepared EPM/AgNW composites have a great potential for applications in modern electronics.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Electromagnetic wave absorption materials · Advanced Antenna and Metasurface Technologies · Dielectric materials and actuators

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen 518055, China

Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen 518055, China

Shennan Circuits Co., Ltd., Shenzhen 5180117, China

Funding

Guangdong Science and Technology Department · China Postdoctoral Science Foundation · Shenzhen Science and Technology Innovation Commission · National Natural Science Foundation of China · Shenzhen Institutes of Advanced Technology

References (50)

Show source-provided references
1. 10.1016/j.jallcom.2020.15725110.1016/j.jallcom.2020.157251 ↗
2. 10.1016/j.tox.2007.05.01910.1016/j.tox.2007.05.019 ↗
3. 10.1021/acs.nanolett.0c0508110.1021/acs.nanolett.0c05081 ↗
4. 10.1016/j.carbon.2021.02.04710.1016/j.carbon.2021.02.047 ↗
5. 10.1002/adma.20190749910.1002/adma.201907499 ↗
6. 10.3390/ma1209139510.3390/ma12091395 ↗
7. 10.1016/j.cej.2018.03.08510.1016/j.cej.2018.03.085 ↗
8. 10.1039/d0ta01393e10.1039/d0ta01393e ↗
9. 10.1007/s40820-021-00624-410.1007/s40820-021-00624-4 ↗
10. 10.1016/j.compositesa.2017.05.00910.1016/j.compositesa.2017.05.009 ↗
11. 10.1021/acsami.7b1411110.1021/acsami.7b14111 ↗
12. 10.1021/acsami.7b0764310.1021/acsami.7b07643 ↗
13. 10.1016/j.cej.2020.12458910.1016/j.cej.2020.124589 ↗
14. 10.1016/j.carbon.2020.12.02810.1016/j.carbon.2020.12.028 ↗
15. 10.1016/j.carbon.2019.11.07510.1016/j.carbon.2019.11.075 ↗
16. 10.1007/s40820-021-00665-910.1007/s40820-021-00665-9 ↗
17. 10.1016/j.cej.2016.09.02310.1016/j.cej.2016.09.023 ↗
18. 10.1016/j.compscitech.2019.10768310.1016/j.compscitech.2019.107683 ↗
19. Wei, J.; Xu, Y.; Lin, Z.; Lei, Z.; Fu, X.; Hu, Y.; Sun, R. Lightweight and Compressible Expandable Polymer Microspheres/Silver Flakes Composites for High-efficiency Electromagnetic Interference Shielding. 2021 22nd International Conference on Electronic Packaging Technology (ICEPT), 2021; pp 1–6.10.1109/ICEPT52650.2021.9568188 ↗
20. 10.1021/acsnano.0c0333710.1021/acsnano.0c03337 ↗
21. 10.1016/j.compscitech.2019.10775310.1016/j.compscitech.2019.107753 ↗
22. 10.1021/acsami.0c0444810.1021/acsami.0c04448 ↗
23. 10.1002/admt.20190006010.1002/admt.201900060 ↗
24. 10.1021/acsami.7b0575310.1021/acsami.7b05753 ↗
25. 10.1021/acsnano.0c0240110.1021/acsnano.0c02401 ↗
26. 10.1007/s10118-019-2187-210.1007/s10118-019-2187-2 ↗
27. 10.1021/acsnano.0c1066610.1021/acsnano.0c10666 ↗
28. 10.1016/j.compscitech.2018.08.01310.1016/j.compscitech.2018.08.013 ↗
29. 10.1016/j.compscitech.2018.03.00910.1016/j.compscitech.2018.03.009 ↗
30. 10.1021/acsnano.9b0745210.1021/acsnano.9b07452 ↗
31. 10.1021/acssuschemeng.9b0067810.1021/acssuschemeng.9b00678 ↗
32. 10.1016/j.cej.2019.04.06910.1016/j.cej.2019.04.069 ↗
33. 10.1016/j.compscitech.2019.05.02710.1016/j.compscitech.2019.05.027 ↗
34. 10.1021/acsnano.1c0155210.1021/acsnano.1c01552 ↗
35. 10.1016/j.cej.2020.12464410.1016/j.cej.2020.124644 ↗
36. 10.1007/s40820-021-00766-510.1007/s40820-021-00766-5 ↗
37. 10.1002/adma.20130529310.1002/adma.201305293 ↗
38. 10.1021/acsnano.9b0043410.1021/acsnano.9b00434 ↗
39. 10.1021/acsnano.0c0735210.1021/acsnano.0c07352 ↗
40. 10.1016/j.mser.2013.06.00110.1016/j.mser.2013.06.001 ↗
41. 10.1016/j.matt.2021.02.02210.1016/j.matt.2021.02.022 ↗
42. 10.1021/acsami.8b0705410.1021/acsami.8b07054 ↗
43. 10.1109/mwc.2018.170043610.1109/mwc.2018.1700436 ↗
44. 10.1016/s0008-6223(00)00184-610.1016/s0008-6223(00)00184-6 ↗
45. 10.1002/adfm.20200088310.1002/adfm.202000883 ↗
46. 10.1002/smll.20180053410.1002/smll.201800534 ↗
47. 10.1016/j.cej.2021.12996210.1016/j.cej.2021.129962 ↗
48. 10.1016/j.compositesa.2020.10618810.1016/j.compositesa.2020.106188 ↗
49. 10.1039/d0ta09246k10.1039/d0ta09246k ↗
50. Ding, L.; Ding, Z. Y.; Wei, X. C. Shielding Effectiveness Measurement of SiP Based on Near-Field Scanning, 2019 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA), 2019; pp 136–137.10.1109/ICTA48799.2019.9012921 ↗