DataVXACS Applied Materials & InterfacesPaper
journal article·2015-06-10Open access

Enhancing the Reactivity of Al/CuO Nanolaminates by Cu Incorporation at the Interfaces

Lorena Marín, Charith E. Nanayakkara, Jean-Francois Veyan, Bénédicte Warot-Fonrose, Sébastien Joulie, Alain Estève, Christophe Tenailleau, Yves J. Chabal, Carole Rossi

ACS Applied Materials & Interfaces· Volume 7· Issue 22
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Source abstract

Abstract

In situ deposition of a thin (∼5 nm) layer of copper between Al and CuO layers is shown to increase the overall nanolaminate material reactivity. A combination of transmission electron microscopy imaging, in situ infrared spectroscopy, low energy ion scattering measurements, and first-principles calculations reveals that copper spontaneously diffuses into aluminum layers (substantially less in CuO layers). The formation of an interfacial Al:Cu alloy with melting temperature lower than pure Al metal is responsible for the enhanced reactivity, opening a route to controlling the stochiometry of the aluminum layer and increasing the reactivity of the nanoenergetic multilayer systems in general.
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Research context

Metals & alloysNanomaterialsMaterials processing

OpenAlex topics: nanoparticles nucleation surface interactions · Semiconductor materials and devices · Graphene research and applications

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Affiliations

LAAS-CNRS, 7 Avenue du colonel Roche, F-31077 Toulouse, France

UPS, INSA, INP, ISAE, LAAS, Université de Toulouse, F-31062 Toulouse, France

Department of Materials Science and Engineering, The University of Texas at Dallas, Richardson, Texas 75080, United States

CEMES-CNRS, 29, Rue Jeanne Marvig, F-31055 Toulouse, France

CIRIMAT-CNRS, 118 Route de Narbonne, F-31062 Toulouse Cedex 9, France

Funding

Division of Materials Research · Agence Nationale de la Recherche · Centre National de la Recherche Scientifique · Institut des sciences de l'ingénierie et des systèmes, Centre National de la Recherche Scientifique

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