journal article·2017-01-18

Ultrafine Pitch Stencil Printing of Liquid Metal Alloys

Nathan Lazarus, Sarah S. Bedair, Iain M. Kierzewski

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Abstract

With high conductivity and stretchable for large cross-sections, liquid metals such as galinstan are promising for creating stretchable devices and interconnects. Creating high resolution features in parallel is challenging, with most techniques limited to a hundred micrometers or more. In this work, multilevel electroplated stencils are investigated for printing liquid metals, with galinstan features as small as ten micrometers printed on soft elastomers, a factor of 10 reduction over past liquid metal stencil printing. Capacitors and resistive strain sensors are also demonstrated, showing the potential for creating stretchable conductors and devices.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Nanomaterials and Printing Technologies · Tactile and Sensory Interactions

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

U.S. Army Research Laboratory, 2800 Powder Mill Road, Adelphi, Maryland 20783, United States

General Technical Services Inc. at Army Research Laboratory, 2800 Powder Mill Road, Adelphi, Maryland 20783, United States

References (31)

Show source-provided references
1. 10.1002/adfm.20090060410.1002/adfm.200900604 ↗
2. 10.1088/0964-1726/22/5/05502310.1088/0964-1726/22/5/055023 ↗
3. 10.1088/0964-1726/23/8/08503610.1088/0964-1726/23/8/085036 ↗
4. 10.1109/JMEMS.2014.230735810.1109/JMEMS.2014.2307358 ↗
5. 10.1038/srep0109810.1038/srep01098 ↗
6. 10.1039/C5TC00330J10.1039/C5TC00330J ↗
7. 10.1002/adma.20140479010.1002/adma.201404790 ↗
8. 10.1021/acsami.6b0189610.1021/acsami.6b01896 ↗
9. 10.1016/j.snb.2015.07.06210.1016/j.snb.2015.07.062 ↗
10. 10.1002/adma.20140050210.1002/adma.201400502 ↗
11. 10.1108/0954091121119854010.1108/09540911211198540 ↗
12. 10.1039/c2lc21176a10.1039/c2lc21176a ↗
13. 10.1002/adfm.20070121610.1002/adfm.200701216 ↗
14. 10.1039/c2lc40628d10.1039/c2lc40628d ↗
15. 10.1109/ICRA.2013.663107110.1109/ICRA.2013.6631071 ↗
16. 10.3390/s14091631110.3390/s140916311 ↗
17. 10.1109/ICSENS.2013.668821710.1109/ICSENS.2013.6688217 ↗
18. 10.1109/TEPM.2004.83796510.1109/TEPM.2004.837965 ↗
19. 10.1109/TCAPT.2007.89208510.1109/TCAPT.2007.892085 ↗
20. Manessis, D.; Patzelt, R.; Ostmann, A.; Aschenbrenner, R.; Reichl, H.; Kay, R.; de Gourcuff, E.Latest Technological Advancements in Stencil Printing Processes for Ultra-fine-pitch Flip Chip Bumping Down to 60 μm Pitch. InProceedings of the 39th International Symposium on Microelectronics;San Diego, CA, Oct 8–12, 2006;International Microelectronics and Packaging Society:Washington, D.C., 2006.
21. Manessis D. · Proc. EMPC 2005 · 2005 · 427
22. 10.1007/s12540-013-5025-z10.1007/s12540-013-5025-z ↗
23. 10.1109/MEMSYS.2014.676568110.1109/MEMSYS.2014.6765681 ↗
24. 10.1109/MEMSYS.2015.705094110.1109/MEMSYS.2015.7050941 ↗
25. 10.1109/TMAG.2010.204574210.1109/TMAG.2010.2045742 ↗
26. Hagman, A.Print and Roll: A Technique for Rapid Production of Stretchable Liquid Alloy Circuits.M.S. Thesis,Uppsala University,Uppsala, Sweden, 2010.
27. 10.1109/ECTC.2005.144137110.1109/ECTC.2005.1441371 ↗
28. 10.1109/JSEN.2012.220079010.1109/JSEN.2012.2200790 ↗
29. 10.1002/adfm.20120240510.1002/adfm.201202405 ↗
30. 10.1002/adfm.20130322010.1002/adfm.201303220 ↗
31. 10.1126/science.120615710.1126/science.1206157 ↗