journal article·2020-10-07

Wearable Circuits Sintered at Room Temperature Directly on the Skin Surface for Health Monitoring

Ling Zhang, Hongjun Ji, Houbing Huang, Ning Yi, Xiaoming Shi, Senpei Xie, Yaoyin Li, Ziheng Ye, Pengdong Feng, Tiesong Lin, Xiangli Liu, Xuesong Leng, Mingyu Li, Jiaheng Zhang, Xing Ma, Peng He, Weiwei Zhao, Huanyu Cheng

ACS Applied Materials & Interfaces· Volume 12· Issue 40
Publisher page

Abstract

A soft body area sensor network presents a promising direction in wearable devices to integrate on-body sensors for physiological signal monitoring and flexible printed circuit boards (FPCBs) for signal conditioning/readout and wireless transmission. However, its realization currently relies on various sophisticated fabrication approaches such as lithography or direct printing on a carrier substrate before attaching to the body. Here, we report a universal fabrication scheme to enable printing and room-temperature sintering of the metal nanoparticle on paper/fabric for FPCBs and directly on the human skin for on-body sensors with a novel sintering aid layer. Consisting of polyvinyl alcohol (PVA) paste and nanoadditives in the water, the sintering aid layer reduces the sintering temperature. Together with the significantly decreased surface roughness, it allows for the integration of a submicron-thick conductive pattern with enhanced electromechanical performance. Various on-body sensors integrated with an FPCB to detect health conditions illustrate a system-level example.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Green IT and Sustainability · Nanomaterials and Printing Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

State Key Laboratory of Advanced Welding & Joining, Harbin Institute of Technology, Shenzhen 518055, People’s Republic of China

Flexible Printed Electronics Technology Center, Harbin Institute of Technology, Shenzhen 518055, People’s Republic of China

Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802, United States

The School of Material Science and Engineering, Harbin Institute of Technology, Shenzhen 518055, People’s Republic of China

Advanced Research Institute of Multidisciplinary Science, Beijing Institute of Technology, Beijing 100081, China

Department of Materials Science and Engineering, The Pennsylvania State University, University Park, Pennsylvania 16802, United States

Funding

Pennsylvania State University · Division of Electrical, Communications and Cyber Systems · National Natural Science Foundation of China · Bureau of Industry and Information Technology of Shenzhen · Shenzhen Science and Technology Program

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