journal article·2018-01-10

Gecko-Inspired Dry Adhesive Based on Micro–Nanoscale Hierarchical Arrays for Application in Climbing Devices

Hemant Kumar Raut, Avinash Baji, Hassan Hussein Hariri, Hashina Parveen, Gim Song Soh, Hong Yee Low, Kristin L. Wood

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Abstract

The unusual ability of geckos to climb vertical walls underlies a unique combination of a hierarchical structural design and a stiffer material composition. While a dense array of microscopic hierarchical structures enables the gecko toe pads to adhere to various surfaces, a stiffer material (β-keratin) composition enables them to maintain reliable adhesion over innumerable cycles. This unique strategy has been seldom implemented in engineered dry adhesives because fabrication of high-aspect-ratio hierarchical structures using a stiffer polymer is challenging. Herein, we report the fabrication of high-aspect-ratio hierarchical arrays on flexible polycarbonate sheets (stiffness comparable to that of β-keratin) by a sacrificial-layer-mediated nanoimprinting technique. Dry-adhesive films comprising the hierarchical arrays showed a formidable shear adhesion of 11.91 ± 0.43 N/cm 2 . Cyclic adhesion tests also showed that the shear adhesion of the adhesive films reduced by only about 20% after 50 cycles and remained nearly constant until about 200 cycles. Most importantly, the high-aspect-ratio hierarchical arrays were integrated onto the feet of a miniature robot and the locomotion on a 30° inclined surface was demonstrated.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Adhesion, Friction, and Surface Interactions · Force Microscopy Techniques and Applications · Surface Modification and Superhydrophobicity

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Division of Engineering Product Development, Singapore University of Technology and Design, 8 Somapah Rd, Singapore 487372, Republic of Singapore

Funding

Singapore University of Technology and Design · Massachusetts Institute of Technology

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