journal article·2013-11-27

Copper Shell Networks in Polymer Composites for Efficient Thermal Conduction

Seunggun Yu, Jang-Woo Lee, Tae Hee Han, Cheolmin Park, Youngdon Kwon, Soon Man Hong, Chong Min Koo

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Abstract

Thermal management of polymeric composites is a crucial issue to determine the performance and reliability of the devices. Here, we report a straightforward route to prepare polymeric composites with Cu thin film networks. Taking advantage of the fluidity of polymer melt and the ductile properties of Cu films, the polymeric composites were created by the Cu metallization of PS bead and the hot press molding of Cu-plated PS beads. The unique three-dimensional Cu shell-networks in the PS matrix demonstrated isotropic and ideal conductive performance at even extremely low Cu contents. In contrast to the conventional simple melt-mixed Cu beads/PS composites at the same concentration of 23.0 vol %, the PS composites with Cu shell networks indeed revealed 60 times larger thermal conductivity and 8 orders of magnitude larger electrical conductivity. Our strategy offers a straightforward and high-throughput route for the isotropic thermal and electrical conductive composites.
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Research context

OpenAlex topics: Thermal properties of materials · Dielectric materials and actuators · Composite Material Mechanics

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Center for Materials Architecturing, Korea Institute of Science and Technology, Seoul 136-791, Republic of Korea

Department of Materials Science and Engineering, Yonsei University, Seoul 120-749, Republic of Korea

Department of Organic and Nano Engineering, Hanyang University, Seoul 133-791, Republic of Korea

School of Chemical Engineering, Sungkyunkwan University, Suwon 440-746, Republic of Korea

Nanomaterials Science and Engineering, University of Science and Technology, Daejeon 305-350, Republic of Korea

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