journal article·2024-02-27Open access

Ferroelectric Enhancement in a TiN/Hf1–xZrxO2/W Device with Controlled Oxidation of the Bottom Electrode

Santosh P. Chiniwar, Ya-Chen Hsieh, Ching-Hsiang Shih, Chih-Yu Teng, Jheng-Lin Yang, Chenming Hu, Bi-Hsuan Lin, Mau-Tsu Tang, Yuan-Chieh Tseng

Abstract

High Resolution Image Download MS PowerPoint Slide Hf 1– x Z x O 2 (HZO) is a promising ferroelectric (FE) material with CMOS compatibility, while the TiN/HZO/W metal-ferroelectric-metal structure provides balanced thermal expansion for stacking. In this study, we developed a 7 nm film of HZO with a FE polarization (2P r ) value of ∼43 μC/cm 2 and cycling endurance of 10 8 by determining the appropriate oxidation state for a W bottom electrode deposited via atomic layer deposition with a relatively low annealing temperature of 400 °C. To visualize FE uniformity, we used X-ray absorption spectroscopy phase mapping to construct a two-dimensional map of the orthorhombic ( O ), tetragonal ( T ), and monoclinic ( M ) phases of the HZO film. Subsequent orientation- and chemical-state-resolved X-ray analysis revealed that the enhanced FE polarization performance can be attributed to the combined effects of interface strain and oxygen vacancies. Piezoelectric force microscopy verified the switching uniformity of the devices and revealed the electrical characteristics for use in device optimization.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Ferroelectric and Negative Capacitance Devices · Semiconductor materials and devices · Ferroelectric and Piezoelectric Materials

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Material Science & Engineering, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan

International College of Semiconductor Technology, National Yang Ming Chiao Tung University, Hsinchu 30010, Taiwan

Department of Electrical Engineering and Computer Sciences, University of California, Berkeley, California 94720, United States

National Synchrotron Radiation Research Center, Hsinchu 30076, Taiwan

Funding

National Science and Technology Council

References (48)

Show source-provided references
1. 10.1063/1.170009810.1063/1.1700098 ↗
2. Nakamura T. · 1995 · 6810.1109/ISSCC.1995.535279 ↗
3. Horii, Y.; Hikosaka, Y.; Itoh, A.; Matsuura, K.; Kurasawa, M.; Komuro, G.; Maruyama, K.; Eshita, T.; Kashiwagi, S. 4 Mbit embedded FRAM for high performance System on Chip (SoC) with large switching charge, reliable retention and high imprint resistance. In International Electron Devices 2002 Meeting, Technical Digest; IEEE, 2002, pp. 539–542.
4. 10.1063/1.282247210.1063/1.2822472 ↗
5. 10.1063/1.363405210.1063/1.3634052 ↗
6. 10.1557/mrs.2018.9210.1557/mrs.2018.92 ↗
7. 10.1109/JXCDC.2015.244841410.1109/JXCDC.2015.2448414 ↗
8. 10.1126/science.112623010.1126/science.1126230 ↗
9. 10.1088/1361-6641/ac1b1110.1088/1361-6641/ac1b11 ↗
10. 10.1016/j.apsusc.2022.15311010.1016/j.apsusc.2022.153110 ↗
11. 10.1002/adma.20140453110.1002/adma.201404531 ↗
12. 10.1063/1.495494210.1063/1.4954942 ↗
13. 10.1016/j.sse.2011.09.01610.1016/j.sse.2011.09.016 ↗
14. 10.1063/5.006247510.1063/5.0062475 ↗
15. 10.1063/1.486600810.1063/1.4866008 ↗
16. 10.1109/TED.2020.304617310.1109/TED.2020.3046173 ↗
17. 10.1021/acsaelm.0c0067110.1021/acsaelm.0c00671 ↗
18. 10.1063/1.482217310.1063/1.4822173 ↗
19. 10.1109/JEDS.2021.312600710.1109/JEDS.2021.3126007 ↗
20. 10.3389/fmats.2019.0004910.3389/fmats.2019.00049 ↗
21. 10.1002/adem.20220112410.1002/adem.202201124 ↗
22. 10.1063/1.198407510.1063/1.1984075 ↗
23. 10.1063/1.12161010.1063/1.121610 ↗
24. 10.1080/71371616610.1080/713716166 ↗
25. 10.1063/1.149896710.1063/1.1498967 ↗
26. 10.1143/JJAP.38.540610.1143/JJAP.38.5406 ↗
27. 10.1063/1.180519010.1063/1.1805190 ↗
28. 10.1007/s00339-018-1955-010.1007/s00339-018-1955-0 ↗
29. 10.1021/acsaelm.2c0158210.1021/acsaelm.2c01582 ↗
30. 10.1021/acsomega.2c0623710.1021/acsomega.2c06237 ↗
31. 10.1063/5.012954610.1063/5.0129546 ↗
32. 10.1063/5.002951610.1063/5.0029516 ↗
33. 10.1021/acsami.1c0826510.1021/acsami.1c08265 ↗
34. 10.1002/advs.20200126610.1002/advs.202001266 ↗
35. 10.1002/adfm.20220960410.1002/adfm.202209604 ↗
36. 10.1109/TED.2018.281696810.1109/TED.2018.2816968 ↗
37. Hoffmann M. · 2018 · 31.36.31
38. 10.1109/LED.2019.294496010.1109/LED.2019.2944960 ↗
39. 10.1109/TED.2023.326591310.1109/TED.2023.3265913 ↗
40. Huang F. · 2023 · 1
41. 10.1063/1.502671510.1063/1.5026715 ↗
42. Wei W. · 2020 · 39.36.31
43. Lin Y.-D. · 2021 · 6.4.110.1109/IEDM19574.2021.9720692 ↗
44. 10.1063/5.007546610.1063/5.0075466 ↗
45. 10.1109/LED.2021.307508210.1109/LED.2021.3075082 ↗
46. 10.1002/pssa.20190084010.1002/pssa.201900840 ↗
47. 10.1021/cr900056b10.1021/cr900056b ↗
48. 10.1016/j.apsusc.2020.14701410.1016/j.apsusc.2020.147014 ↗