journal article·2021-01-26

Microstructuring GaAs Using Reverse-Patterning Lithography: Implications for Transistors and Solar Cells

Tianlang Yu, Devendra Khatiwada, Sahil Sharma, Maria D. Marquez, Venkat Selvamanickam, T. Randall Lee

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Abstract

This paper introduces reverse patterning lithography (RPL), which combines microcontact printing (μCP) of a custom-designed fluorinated adsorbate on gallium arsenide (GaAs) and the deposition of a polymeric resin as a wet-etching resist. Positive patterns were formed on GaAs wafers having various designed shapes and sharp edges at a lateral resolution of 100.0 μm and a depth of up to 3.0 μm. The RPL method benefits from being cost-effective and time-efficient compared to conventional photolithography and has the potential for use in the fabrication of various GaAs devices, including solar cells, light-emitting diodes, and microwave and radio frequency transistors.
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Research context

OpenAlex topics: Nanofabrication and Lithography Techniques · Advancements in Photolithography Techniques · Nanowire Synthesis and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Chemistry, the Texas Center for Superconductivity, and the Advanced Manufacturing Institute, University of Houston, Houston, Texas 77204-5003, United States

Department of Mechanical Engineering, the Texas Center for Superconductivity, and the Advanced Manufacturing Institute, University of Houston, Houston, Texas 77204-4006, United States

Funding

Division of Chemistry · Welch Foundation · Texas Center for Superconductivity, University of Houston · Advanced Manufacturing Institute, University of Houston

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