Preparation and soft lithographic printing of nano-sized ITO-dispersions for the manufacture of electrodes for TFTs
Source abstract
Abstract
The production of printed electronics exhibits an enormous economical potential due to the possibility to manufacture innovative products at low cost. At the moment, one of the major challenges for the fabrication of printed electronics is the controllability of the material properties during processing and the miniaturization of the deposited structures. In this context, the application of soft lithographic techniques appears promising, because they allow a defined patterning of the materials in the range of few nanometers, which is far below the limits of other printing techniques like inkjet-printing or screen printing. This work proves the applicability of the soft lithographic technique micro-molding in capillaries (MIMIC) for the manufacture of conductive indium tin oxide (ITO) electrodes. For the creation of stable dispersions of ITO nano-sized particles, steric as well as electrostatic stabilization concepts are applied. The prepared dispersions are characterized with regard to the later processing via MIMIC. The geometry and the electrical properties of the soft lithographically deposited structures are determined to prove their functionality. Special attention is paid to the influence of the wetting behavior of the dispersions on the resulting geometry of the structures. Finally, the applicability of the optimized structures is demonstrated by the assembly of a thin film transistor (TFT), in which the deposited structures serve as source and drain electrodes.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Nanofabrication and Lithography Techniques · Nanomaterials and Printing Technologies · Advancements in Photolithography Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (26)
Show source-provided references
1. Dimitrakopoulos CD, Malenfant PRL (2002) Adv Mater 14:9910.1002/1521-4095(20020116)14:2<99::AID-ADMA99>3.0.CO;2-9 ↗
2. Loo Y-L, McCulloch I (2008) MRS Bull 33:65310.1557/mrs2008.149 ↗
3. Sekitani T, Noguchi Y, Zschieschang U, Klauk H, Someya T (2008) Proc Natl Acad Sci USA 105:497610.1073/pnas.0708340105 ↗
4. Kim S-M, Seo K-H, Lee J-H, Kim J-J, Lee HY, Lee J-S (2006) J Eur Ceram Soc 26:7310.1016/j.jeurceramsoc.2004.10.009 ↗
5. Delamarche E, Juncker D, Schmid H (2005) Adv Mater 17:291110.1002/adma.200501129 ↗
6. Jeon NL, Clem P, Jung DY, Lin W, Girolami GS, Payne DA, Nuzzo RG (1997) Adv Mater 9:89110.1002/adma.19970091107 ↗
7. Parashkov R, Becker E, Riedl T, Johannes H-H, Kowalsky W (2005) Adv Mater 17:152310.1002/adma.200401967 ↗
8. Cosseddu P, Bonfiglio A (2006) Appl Phys Lett 88:110.1063/1.2166487 ↗
9. Blümel A, Klug A, Eder S, Scherf U, Moderegger E, List EJW (2007) Org Electron 8:38910.1016/j.orgel.2007.01.009 ↗
10. Zschieschang U, Halik M, Klauk H (2008) Langmuir 24:166510.1021/la703818d ↗
11. Xia Y, Whitesides GM (1998) Annu Rev Mater Sci 28:15310.1146/annurev.matsci.28.1.153 ↗
12. Ahn BY, Duoss EB, Motala MJ, Guo X, Park S-I, Xiong Y, Yoon J, Nuzzo RG, Rogers JA, Lewis JA (2009) Science 323:159010.1126/science.1168375 ↗
13. Reindl A, Mahajeri J, Peukert W (2009) Thin Solid Films 517:162410.1016/j.tsf.2008.09.071 ↗
14. de Hazan Y, Heinecke J, Weber A, Graule T (2009) J Colloid Interf Sci 337:6610.1016/j.jcis.2009.05.012 ↗
15. de Hazan Y, Reuter T, Werner D, Clasen R, Graule T (2008) J Colloid Interf Sci 323:29310.1016/j.jcis.2008.03.036 ↗
16. Widegren J, Bergström L (2002) J Am Ceram Soc 85:52310.1111/j.1151-2916.2002.tb00127.x ↗
17. Rogers JA, Nuzzo RG (2005) Mater Today 8:5010.1016/S1369-7021(05)00702-9 ↗
18. Schmitt H, Zeidler M, Rommel M, Bauer AJ, Ryssel H (2008) Microelectron Eng 85:89710.1016/j.mee.2008.01.075 ↗
19. Delamarche E, Donzel C, Kamounah FS, Wolf H, Geissler M, Stutz R, Schmidt-Winkel P, Michel B, Mathieu HJ, Schaumburg K (2003) Langmuir 19:874910.1021/la034370n ↗
20. Gross M, Winnacker A, Wellmann PJ (2007) Thin Solid Films 515:856710.1016/j.tsf.2007.03.136 ↗
21. Lutz C, Roosen A (1998) Wetting behaviour of tape casting slurries on tape carriers. In: Messing GL, Lange FF, Hirano S (eds) Ceramic transactions, vol 83. The American Ceramic Society, Columbus, OH, pp 163–170
22. Martin CR, Aksay IA (2003) J Phys Chem B 107:426110.1021/jp034055+ ↗
23. Delamarche E, Schmid H, Biebuyck H, Michel B (1997) Adv Mater 9:74110.1002/adma.19970090914 ↗
24. Hsia KJ, Huang Y, Menard E, Park J-U, Zhou W, Rogers J, Fulton JM (2005) Appl Phys Lett 86:110.1063/1.1900303 ↗
25. Huang YY, Zhou W, Hsia KJ, Menard E, Park J-U, Rogers JA, Alleyne AG (2005) Langmuir 21:805810.1021/la0502185 ↗
26. Granqvist CG, Hultåker A (2002) Thin Solid Films 411:110.1016/S0040-6090(02)00163-3 ↗