Fracture behavior of Cu-cored solder joints
Source abstract
Abstract
Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions, e.g., in microelectronic semiconductors used in transportation systems. Cu-cored solder joints with two different coating layers, Sn–3.0Ag and Sn–1.0In, were compared with the baseline Sn–3.0Ag–0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull and normal-speed shear tests. The Cu-cored solder joint with the Sn–1.0In plating layer exhibited the highest ball-pull and shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer than the interface fracture percentage in the Sn–3.0Ag plating layer due to the improved wettability between the Cu-core and Sn–1.0In plating layer.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Metal Forming Simulation Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (40)
Show source-provided references
1. Gee S, Kelkar N, Huang J, Tu KN (2005) In: Proceedings of IPACK2005. ASME InterPACK‘05, San Francisco, p 1313
2. Chen CM, Lin HC (2006) J Electron Mater 35:193710.1007/s11664-006-0297-4 ↗
3. Tan YC, Tan CM, Ng TC (2010) Microelectron Reliab 50:135210.1016/j.microrel.2010.07.051 ↗
4. Liu L, Zhou W, Zhang H, Li B, Wu P (2010) Microelectron Reliab 50:25110.1016/j.microrel.2009.09.018 ↗
5. Ha SS, Kim JW, Yoon JW, Ha SO, Jung SB (2009) J Electron Mater 38:7010.1007/s11664-008-0574-5 ↗
6. Tseng HW, Lu CT, Hsiao YH, Liao PL, Chuang YC, Chung TY, Liu CY (2010) Microelectron Reliab 50:115910.1016/j.microrel.2010.05.002 ↗
7. Shohji I, Shiratori Y, Yoshida H, Mizukami M, Ichida A (2004) Mater Trans 45:75410.2320/matertrans.45.754 ↗
8. Lee JH, Lim GT, Yang ST, Suh MS, Chung QH, Byun KY, Park YB (2008) J Kor Inst Met Mater 46:310
9. Ma L, Xu G, Sun J, Guo F, Wang X (2011) J Mater Sci 46:4896. doi: https://doi.org/10.1007/s10853-011-5401-310.1007/s10853-011-5401-3 ↗
10. Sung JY, Pyo SE, Koo JM, Yoon JW, Shin YE, Jung SB (2009) J Kor Inst Met Mater 47:261
11. Chen F, Gao F, Zhang J, Jin W, Xiao X (2011) J Mater Sci 46:3424. doi: https://doi.org/10.1007/s10853-010-5231-810.1007/s10853-010-5231-8 ↗
12. Chuang TH, Wu HM, Cheng MD, Chang SY, Yen SF (2004) J Electron Mater 33:2210.1007/s11664-004-0289-1 ↗
13. Chuang CM, Shih PC, Lin KL (2004) J Electron Mater 33:110.1007/s11664-004-0286-4 ↗
14. Dybkov VI, Khoruzha VG, Sidorko VR, Meleshevich KA, Samelyuk AV, Berry DC, Barmak K (2009) J Mater Sci 44:5960. doi: https://doi.org/10.1007/s10853-009-3717-z10.1007/s10853-009-3717-z ↗
15. Oh C, Park N, Han C, Bang M, Hong W (2009) J Kor Inst Met Mater 47:500
16. You T, Kim Y, Kim J, Lee J, Jung B, Moon J, Choe H (2009) J Electron Mater 38:41010.1007/s11664-008-0633-y ↗
17. Qi Y, Lam R, Ghorbani HR, Snugovsky P, Spelt JK (2006) Microelectron Reliab 46:57410.1016/j.microrel.2005.01.008 ↗
18. Sun J, Xu G, Guo F, Xia Z, Lei Y, Shi Y, Li X, Wang X (2011) J Mater Sci 46:3544. doi: https://doi.org/10.1007/s10853-011-5265-610.1007/s10853-011-5265-6 ↗
19. Guo F, Xu G, He H (2009) J Mater Sci 44:5595. doi: https://doi.org/10.1007/s10853-009-3787-y10.1007/s10853-009-3787-y ↗
20. He H, Xu G, Guo F (2010) J Mater Sci 45:929. doi: https://doi.org/10.1007/s10853-009-4022-610.1007/s10853-009-4022-6 ↗
21. Jung DJ, Park DY, Lee JK, Kim HJ, Lee KA (2008) J Kor Inst Met Mater 46:321
22. Uenishi K, Kohara Y, Sakatani S, Saeki T, Kobayashi KF, Yamamoto M (2002) Mater Trans 43:183310.2320/matertrans.43.1833 ↗
23. Liang J, Downes S, Dariavach N, Shangguan D, Heinrich SM (2004) J Electron Mater 33:150710.1007/s11664-004-0092-z ↗
24. Imae S, Sugitani Y, Nishida M, Kajita O, Takeuchi T (2006) In: Powder metallurgy. Word Congress, Kyoto, p 1207
25. Dutta I, Raj R, Kumar P, Chen T, Nagaraj CM, Liu J, Renavikar M, Wakharkar V (2009) J Electron Mater 38:273510.1007/s11664-009-0898-9 ↗
26. Brandes EA, Brook GB (1997) Smithells metals reference book, 7th edn. Butterworth Heinemann, Oxford
27. Lee JH, Eom YS, Choi KS, Choi BS, Yoon HG, Moon JT, Kim YS (2004) J Electron Mater 33:27710.1007/s11664-004-0133-7 ↗
28. Šebo P, Moser Z, Švec P, Janičkovič D, Dobročka E, Gasior W, Pstruś J (2009) J Alloys Compd 480:40910.1016/j.jallcom.2009.02.110 ↗
29. Lin SK, Yang CF, Wu SH, Chen SW (2008) J Electron Mater 37:49810.1007/s11664-008-0380-0 ↗
30. Chiang MJ, Chang SY, Chuang TH (2004) J Electron Mater 33:3410.1007/s11664-004-0291-7 ↗
31. Liu P, Yao P, Liu J (2009) J Alloys Compd 470:18810.1016/j.jallcom.2008.02.102 ↗
32. Kanlayasiri K, Mongkolwongrojn M, Ariga T (2009) J Alloys Compd 485:22510.1016/j.jallcom.2009.06.020 ↗
33. You T, Kim Y, Jung W, Moon J, Choe H (2009) J Alloys Compd 486:24210.1016/j.jallcom.2009.07.085 ↗
34. Chin YT, Lam PK, Yow HK, Tou TY (2008) Microelectron Reliab 48:107910.1016/j.microrel.2008.04.003 ↗
35. Chen WM, McCloskey P, O’Mathuna SC (2006) Microelectron Reliab 46:89610.1016/j.microrel.2005.06.006 ↗
36. Wong EH, Rajoo R, Seah SKW, Selvanayagam CS, van Driel WD, Caers JFJM, Zhao XJ, Owens N, Tan LC, Leoni M, Eu PL, Lai YS, Yeh CL (2008) Microelectron Reliab 48:106910.1016/j.microrel.2008.04.008 ↗
37. Mei Z, Morris JW Jr (1992) J Electron Mater 21:59910.1007/BF02655427 ↗
38. Wang YT, Ho CJ, Tsai HL (2010) Mater Trans 51:173510.2320/matertrans.MJ201004 ↗
39. Hong E, Kaplin B, You T, Suh M, Kim Y, Choe H (2011) Wear 270(9–10):59110.1016/j.wear.2011.01.015 ↗
40. Davis JR (2001) ASM specialty handbook copper and copper alloys. ASM international, Ohio