Self-Heating Effect in a MoS₂ Field-Effect Transistor and Improved Heat Dissipation by the BN Capping Layer

The inefficient heat dissipation in two-dimensional (2D) semiconductor-based field-effect transistors (FETs) hampers their electrical performance and reliability. In this study, we address this issue by experimentally investigating the factors influencing the self-heating of MoS 2 -based 2D FETs and enhancing the heat dissipation of MoS 2 -based 2D FETs using a high thermal conductivity BN capping layer. The results demonstrate a significant reduction in the negative differential resistance (NDR) with 2D BN encapsulation, leading to improved electrical properties, such as increased saturation current density (average increase of 15.42%, maximum increase of 42%), and device saturation power density (average increase of 15.77%). This research sheds light on the self-heating effect in 2D FET devices and provides valuable insights for enhancing heat dissipation in 2D FETs through the use of high thermal conductivity insulator capping materials.