journal article·2020-07

Influence of frequency and gamma irradiation on the electrical characteristics of Er2O3, Gd2O3, Yb2O3, and HfO2 MOS-based devices

Aysegul Kahraman, Seetharama C. Deevi, Ercan Yilmaz

Journal of Materials Science· Volume 55· Issue 19
Publisher page

Abstract

The unique physical, chemical, and electronic properties of rare earth oxides have been of immense interest to replace SiO2 as a dielectric material in metal–oxide–semiconductor (MOS)-based sensors applications to accurately measure the radiation dosage and increase sensor sensitivities in as diverse applications as space radiation, nuclear physics, medical diagnostics, radiation cancer therapy, and personal dosimetry devices. Hence, the electrical characteristics of oxides prior to and after irradiation of MOS-based devices are needed since they are the backbone of the devices such as MOSFETs and ICs. In addition, an understanding of the behaviour of high-k dielectric oxides in an MOS configuration is necessary since the radiation-induced damage occurs in the bulk oxide film and/or near the oxide–semiconductor interface resulting in creation of lattice defects. Hence, MOS structures with the rare earth oxides of Er2O3, Gd2O3, Yb2O3, and a transition metal oxide of HfO2 were produced by RF magnetron sputtering to determine (a) the structure of the films, (b) dielectric constants, (c) capacitance versus voltage behaviour of Er2O3, Gd2O3, Yb2O3, and HfO2 prior to and after irradiation of the devices in the dose range of 0–76 Gy. The experimental results were analysed with a theoretical framework on the energy band diagram and the radiation effects on the electrical characteristics of the MOS capacitors. The characteristics of the devices were evaluated by using effective oxide charge density ( $$ Q_{\text{EFF}} $$ ), variation in the oxide trapped charge density ( $$ \Delta N_{\text{ox}} $$ ), and interface trapped charge density ( $$ \Delta N_{\text{it}} $$ ). In addition, barrier height ( $$ \phi_{\text{b}} $$ ), image force barrier lowering ( $$ \Delta \phi_{\text{b}} $$ ), acceptor concentration ( $$ N_{\text{a}} $$ ) were calculated before and after irradiation and examined the nature of interface states. The radiation responses of the Er2O3 and HfO2 MOS capacitors did not show a stable behaviour with an increase in radiation dose due to possible neutral electron trap centres. Contrary to expectations, we infer that more negative charges are trapped in Gd2O3-based device than positive charges with an increase in radiation dose. The C–V curves of the Yb2O3 MOS capacitor shifted in the same direction at both 100 kHz and 1 MHz, and as expected, positive charge traps in the structure are more efficient than negative charges. The observed sensitivities of Yb2O3 MOS capacitors are 4–7 times higher than those of SiO2, and the sensitivities of the Yb2O3 MOS capacitors with a total radiation dose of 70 Gy were found to be around 28.08 mV/Gy at both 100 kHZ and 1 MHz frequencies. The Yb2O3 appears to be a promising dielectric candidate for developing a new generation of radiation sensors with an excellent interface quality when compared to rare earth mixed oxides such as silicates, transition metal oxides, and the silicates based on transition metals, Al2O3, and BiFeO3. Our review of the literature suggests that while the radiation damage has been assessed comprehensively based on the C–V characteristics, microstructural characterization of the irradiated films and their interfaces is lacking even though the quality of oxide/Si interface is the most important feature of the devices. The electrical data should be correlated with the inferences from XPS, AFM, TEM, XRD, and other techniques. Further progress requires selection and validation of material properties based on theoretical calculations and predications, utilization of diverse thin film processing and characterization techniques, determining the effect of thickness on the properties of MOS capacitors, a thorough understanding of the interfaces, effect of frequency on the MOS capacitors and the interface characteristics, effect of radiation on the physical, interfacial, and electrical characteristics of MOS capacitors, and preparation and characterization of sensors based on thin films of novel mixed oxides and silicates of different chemistries.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Semiconductor materials and devices · Integrated Circuits and Semiconductor Failure Analysis · Electronic and Structural Properties of Oxides

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (100+)

Show source-provided references
1. Greinacher E (1981) History of rare earth applications, rare earth market today. Am Chem Soc 164:3–17. https://doi.org/10.1021/bk-1981-0164.ch00110.1021/bk-1981-0164.ch001 ↗
2. Gschneidner KA (1984) Past, present and future of rare earth metallurgy. J Less-Common Met 100:1–13. https://doi.org/10.1016/0022-5088(84)90050-X10.1016/0022-5088(84)90050-X ↗
3. Gschneidner KA, Eyring LR (1988) Handbook on the physics and chemistry of rare earths. Elseiver, Amsterdam
4. Jha AR (2014) Rare earth materials: properties and applications, 1st edn. CRC Press, Taylor & Francis group, Boca Raton10.1201/b17045 ↗
5. Van Gosen BS, Verplanck PL, Seal RR, Long KR, Gambogi J (2017) Rare-earth elements. In: Chap. O of critical mineral resources of the United States-economic and environmental geology and prospects for future supply. U.S. Geol. Surv. Prof. Pap. 1802, pp 1–31. https://doi.org/10.3133/pp1802o10.3133/pp1802o ↗
6. Swift DTK (2014) The economic benefits of the North American rare earths industry. Rare Earth Technol Alliance Am Technol Counc 1–30. http://www.rareearthtechalliance.com/Resources/The-Economic-Benefits-of-the-North-American-Rare-Earths-Industry.pdf. Accessed 15 Mar 2020
7. U.S. Department of Energy (2011) Critical materials strategy. Crit Mater Strateg 1–190. https://www.energy.gov/sites/prod/files/DOE_CMS2011_FINAL_Full.pdf. Accessed 15 Mar 2020
8. Jha AR (2016) Next-generation batteries and fuel cells for commercial, military, and space applications. CRC Press, Taylor & Francis Group, Boca Raton. https://doi.org/10.1201/b1215210.1201/b12152 ↗
9. Beaudry BJ, Gschneidner KA (1978) Chapter 2: Preparation and basic properties of the rare earth metals. In: Geschneider KA, Eyring L (eds) Handbook on the physics and chemistry of rare earths. Elsevier, New York. https://doi.org/10.1016/s0168-1273(78)01006-510.1016/s0168-1273(78)01006-5 ↗
10. Rare-earth element-Minerals and ores|Britannica. https://www.britannica.com/science/rare-earth-element/Minerals-and-ores. Accessed 25 Dec 2019
11. Mikhelashvili V, Eisenstein G, Edelman F, Brener R, Zakharov N, Werner P (2004) Structural and electrical properties of electron beam gun evaporated Er2O3 insulator thin films. J Appl Phys 95:613–620. https://doi.org/10.1063/1.163334210.1063/1.1633342 ↗
12. Ohno Y (2008) XPS studies of the intermediate valence state of Yb in (YbS)1.25CrS2. J Electron Spectrosc Relat Phenom 165:1–4. https://doi.org/10.1016/j.elspec.2008.05.00910.1016/j.elspec.2008.05.009 ↗
13. Mukherjee S, Chen CH, Chou CC, Yang HD (2010) Anomalous dielectric behavior in nanoparticle Eu2O3:SiO2 glass composite system. Europhys Lett. https://doi.org/10.1209/0295-5075/92/5701010.1209/0295-5075/92/57010 ↗
14. Yilmaz E, Kaya S (2016) A detailed study on zero-bias irradiation responses of La2O3 MOS capacitors. IEEE Trans Nucl Sci 63:1301–1305. https://doi.org/10.1109/TNS.2016.253078210.1109/TNS.2016.2530782 ↗
15. Kao CH, Chen H, Pan YT, Chiu JS, Lin SP, Lai CS (2010) The investigation of the high-k Gd2O3 (gadolinium oxide) interdielectrics deposited on the polycrystalline silicon. J Electrochem Soc 157:915–918. https://doi.org/10.1149/1.345886510.1149/1.3458865 ↗
16. Jeon S, Im K, Yang H, Lee H, Sim H, Choi S, Jang T, Hwang H (2001) Excellent electrical characteristics of lanthanide (Pr, Nd, Sm, Gd, and Dy) oxide and lanthanide-doped oxide for MOS gate dielectric applications. In: Technical digest—international electron devices meeting, pp 471–474. https://doi.org/10.1109/iedm.2001.97954510.1109/iedm.2001.979545 ↗
17. Pan TM, Yen LC, Hu CW, Chao TS (2010) Structural and electrical properties of high-k HoTiO3 gate dielectrics. ECS Trans 28:241–245. https://doi.org/10.1149/1.337560710.1149/1.3375607 ↗
18. Roh K, Yang S, Hong B, Roh Y, Kim J, Jung D (2002) Structural and electrical properties of yttrium oxide with tungsten gate. J Korean Phys Soc 40:103–106
19. Zhang J, Wong H, Yu D, Kakushima K, Iwai H (2014) X-ray photoelectron spectroscopy study of high-k CeO2/La2O3 stacked dielectrics. AIP Adv 4:117117–1–117117–9. https://doi.org/10.1063/1.490201710.1063/1.4902017 ↗
20. Robertson J (2004) High dielectric constant oxides. Eur Phys J Appl Phys 28:265–291. https://doi.org/10.1051/epjap:200420610.1051/epjap:2004206 ↗
21. Alarcón-Flores G, Aguilar-Frutis M, Falcony C, García-Hipolito M, Araiza-Ibarra JJ, Herrera-Suárez HJ (2006) Low interface states and high dielectric constant Y2O3 films on Si substrates. J Vac Sci Technol B Microelectron Nanometer Struct 24:1873–1877. https://doi.org/10.1116/1.221471010.1116/1.2214710 ↗
22. Kar DMS, De Gendt S, Houssa M, Landheer D, Iwai H (eds) (2006) Physics and technology of high-k gate dielectrics 4. Electrochemical Society Inc, New Jersey, pp 1–547
23. Pan TM, Huang CC (2010) Effects of oxygen content and postdeposition annealing on the physical and electrical properties of thin Sm2O3 gate dielectrics. Appl Surf Sci 256:7186–7193. https://doi.org/10.1016/j.apsusc.2010.05.04810.1016/j.apsusc.2010.05.048 ↗
24. Yang D, Xue LJ, Devine RAB (2003) Charge trapping in and electrical properties of pulsed laser deposited Sm2O3 films. J Appl Phys 93:9389–9391. https://doi.org/10.1063/1.156966010.1063/1.1569660 ↗
25. Nakane H, Noya A, Kuriki S, Matsumoto G (1979) Dielectric properties of europium oxide films. Thin Solid Films 59:291–293. https://doi.org/10.1016/0040-6090(79)90438-310.1016/0040-6090(79)90438-3 ↗
26. Kahraman A (2018) Understanding of post deposition annealing and substrate temperature effects on structural and electrical properties of Gd2O3 MOS capacitor. J Mater Sci Mater Electron 29:7993–8001. https://doi.org/10.1007/s10854-018-8804-y10.1007/s10854-018-8804-y ↗
27. Robertson J (2000) Band offsets of wide-band-gap oxides and implications for future electronic devices. J Vac Sci Technol B Microelectron Nanometer Struct 18:1785–1791. https://doi.org/10.1116/1.59147210.1116/1.591472 ↗
28. Li Y, Chen N, Zhou J, Song S, Liu L, Yin Z, Cai C (2004) Effect of the oxygen concentration on the properties of Gd2O3 thin films. J Cryst Growth 265:548–552. https://doi.org/10.1016/j.jcrysgro.2004.02.09510.1016/j.jcrysgro.2004.02.095 ↗
29. Huang MRS, Liu C-P, Wang J-C, Chen Y-K, Lai C-S, Fang Y-C, Shu L (2012) Microstructural effect of gadolinium oxide nanocrystals upon annealing on electrical properties of memory devices. Thin Solid Films 520:5579–5583. https://doi.org/10.1016/J.TSF.2012.04.04210.1016/J.TSF.2012.04.042 ↗
30. Xu R, Tao Q, Yang Y, Takoudis CG (2012) Atomic layer deposition and characterization of stoichiometric erbium oxide thin dielectrics on Si(100) using (CpMe)3Er precursor and ozone. Appl Surf Sci 258:8514–8520. https://doi.org/10.1016/j.apsusc.2012.05.01910.1016/j.apsusc.2012.05.019 ↗
31. Adelhelm C, Pickert T, Balden M, Rasinski M, Plocinski T, Ziebert C, Koch F, Maier H (2009) Monoclinic B-phase erbium sesquioxide (Er2O3) thin films by filtered cathodic arc deposition. Scr Mater 61:789–792. https://doi.org/10.1016/J.SCRIPTAMAT.2009.06.03110.1016/J.SCRIPTAMAT.2009.06.031 ↗
32. Koleshko VM, Babushkina NV (1979) Properties of rare earth oxide films. Thin Solid Films 62:1–4. https://doi.org/10.1016/0040-6090(79)90374-210.1016/0040-6090(79)90374-2 ↗
33. Darmawan P, Chia PS, Lee PS (2007) Rare-earth based ultra-thin Lu2O3 for high-k dielectrics. J Phys Conf Ser 61:229–233. https://doi.org/10.1088/1742-6596/61/1/04610.1088/1742-6596/61/1/046 ↗
34. Robertson J, Wallace RM (2015) High-K materials and metal gates for CMOS applications. Mater Sci Eng R Rep 88:1–41. https://doi.org/10.1016/j.mser.2014.11.00110.1016/j.mser.2014.11.001 ↗
35. Hall S, Buiu O, Mitrovic I, Lu Y, Davey W (2007) Review and perspective of high-k dielectrics on silicon. J Telecommun Inf Technol 2:33–43
36. Gutowski M, Jaffe JE, Liu CL, Stoker M, Hegde RI, Rai RS, Tobin PJ (2002) Thermodynamic stability of high-K dielectric metal oxides ZrO2 and HfO2 in contact with Si and SiO2. Appl Phys Lett 80:1897–1899. https://doi.org/10.1063/1.145869210.1063/1.1458692 ↗
37. Robertson J, Falabretti B (2006) Band offsets of high K gate oxides on III–V semiconductors. J Appl Phys 100:014111–1–014111–8. https://doi.org/10.1063/1.221317010.1063/1.2213170 ↗
38. Regnery S, Thomas R, Ehrhart P, Waser R (2005) SrTa2O6 thin films for high-K dielectric applications grown by chemical vapor deposition on different substrates. J Appl Phys 97:073521–1–073521–8. https://doi.org/10.1063/1.187303310.1063/1.1873033 ↗
39. Seshan K (2018) Reliability issues: reliability imposed limits to scaling. In: Seshan K, Schepis D (eds) Handbook of thin film deposition, 4th edn. Elsevier Inc., New York, pp 43–62. https://doi.org/10.1016/b978-0-12-812311-9.00003-710.1016/b978-0-12-812311-9.00003-7 ↗
40. Kittl JA, Opsomer K, Popovici M, Menou N, Kaczer B, Wang XP, Adelmann C, Pawlak MA, Tomida K, Rothschild A, Govoreanu B, Degraeve R, Schaekers M, Zahid M, Delabie A, Meersschaut J, Polspoel W, Clima S, Pourtois G, Knaepen W, Detavernier C, Afanas’ev VV, Blomberg T, Pierreux D, Swerts J, Fischer P, Maes JW, Manger D, Vandervorst W, Conard T, Franquet A, Favia P, Bender H, Brijs B, Van Elshocht S, Jurczak M, Van Houdt J, Wouters DJ (2009) High-k dielectrics for future generation memory devices (invited paper). Microelectron Eng 86:1789–1795. https://doi.org/10.1016/j.mee.2009.03.04510.1016/j.mee.2009.03.045 ↗
41. Global Radiation Sensing Field Effect Transistor (RADFETs) Market Trends Analysis and Forecasts to 2022—Research and Markets, 2017
42. Felix JA, Fleetwood DM, Schrimpf RD, Hong JG, Lucovsky G, Schwank JR, Shaneyfelt MR (2002) Total-dose radiation response of Hafnium-silicate capacitors. IEEE Trans Nucl Sci 49:3191–3196. https://doi.org/10.1109/TNS.2002.80539210.1109/TNS.2002.805392 ↗
43. Lok R, Kaya S, Karacali H, Yilmaz E (2017) The Co-60 gamma-ray irradiation effects on the Al/HfSiO4/p-Si/Al MOS capacitors. Radiat Phys Chem 141:155–159. https://doi.org/10.1016/j.radphyschem.2017.06.01910.1016/j.radphyschem.2017.06.019 ↗
44. Lelis AJ, Oldham TR, Boesch HE, McLean FB (1989) The nature of the trapped hole annealing process. IEEE Trans Nucl Sci 36:1808–1815. https://doi.org/10.1109/23.4537310.1109/23.45373 ↗
45. Holmes-Siedle A (1974) The space-charge dosimeter general principles of a new method of radiation detection. Nucl Instrum Methods 121:169–17910.1016/0029-554X(74)90153-0 ↗
46. Pejovic SM, Pejovic MM, Stojanov D, Ciraj-Bjelac O (2016) Sensitivity and fading of pMOS dosemeters irradiated with X-ray radiation doses from 1 to 100 cGy. Radiat Prot Dosim 168:33–39. https://doi.org/10.1093/rpd/ncv00610.1093/rpd/ncv006 ↗
47. Falke P, Fischer HH, Seidensticker KJ, Thiel K, Fischer H, Hilchenbach M, Henkel H, Koch A (2016) Cosmic ray dose monitoring using RadFET sensors of the Rosetta instruments SESAME and COSIMA. Acta Astronaut 125:22–29. https://doi.org/10.1016/j.actaastro.2016.03.00110.1016/j.actaastro.2016.03.001 ↗
48. Jaksic A, Ristic G, Pejovic M, Mohammadzadeh A, Sudre C, Lane W (2002) Gamma-ray irradiation and post-irradiation responses of high dose range RADFETs. IEEE Trans Nucl Sci 49:1356–1363. https://doi.org/10.1109/TNS.2002.103966710.1109/TNS.2002.1039667 ↗
49. Iniewski K, Balasiński A, Majkusiak B, Beck RB, Jakubowski A (1989) Series resistance in a MOS capacitor with a thin gate oxide. Solid State Electron 32:137–140. https://doi.org/10.1016/0038-1101(89)90180-910.1016/0038-1101(89)90180-9 ↗
50. Tao J, Zhao CZ, Zhao C, Taechakumput P, Werner M, Taylor S, Chalker PR (2012) Extrinsic and intrinsic frequency dispersion of high-k materials in capacitance–voltage measurements. Materials (Basel) 5:1005–1032. https://doi.org/10.3390/ma506100510.3390/ma5061005 ↗
51. Sze SM, Ng KK (2007) Physics of semiconductor devices. Wiley, Hoboken
52. Lindroos V, Tilli M, Lehto A, Motooka T (2010) Common abbreviations and acronyms. In: Handbook of silicon based MEMS materials technologies. Elsevier, Oxford, pp 617–622. https://doi.org/10.1016/b978-0-8155-1594-4.00052-810.1016/b978-0-8155-1594-4.00052-8 ↗
53. Pierret RF (1996) Semiconductor device fundamentals. Addison-Wesley Publishing Company, Boston
54. Chanana RK (2014) BOEMDET-band offsets and effective mass determination technique utilizing Fowler-Nordheim tunneling slope constants in MIS devices on silicon. IOSR J Appl Phys 6:55–6110.9790/4861-06425561 ↗
55. Xu Y, Schoonen MAA (2000) The absolute energy positions of conduction and valence bands of selected semiconducting minerals. Am Mineral 85:543–556. https://doi.org/10.2138/am-2000-041610.2138/am-2000-0416 ↗
56. Reza AK, Hassan MK, Roy K (2017) Büttiker probe-based modeling of TDDB: application to dielectric breakdown in MTJs and MOS devices. IEEE Trans Electron Devices 64:3337–3345. https://doi.org/10.1109/TED.2017.271516410.1109/TED.2017.2715164 ↗
57. Strong AW, Wu EY, Vollertsen R-P, Sune J, LaRosa G, Sullivan TD (2009) Reliability wearout mechanisms in advanced CMOS technologies. Wiley-IEEE Press, Piscataway10.1002/9780470455265 ↗
58. Van Zeghbroeck B (2011) Principles of semiconductor devices—[book review]. http://ecee.colorado.edu/~bart/ecen3320/newbook/chapter6/ch6_3.htm. Accessed 28 June 2019
59. Ma TP, Dressendorfer PV (1989) Ionizing radiation effects in MOS devices and circuits. Wiley, New York
60. Ristić GS, Pejović MM, Jakšić AB (2007) Physico-chemical processes in metal–oxide–semiconductor transistors with thick gate oxide during high electric field stress. J Non Cryst Solids 353:170–179. https://doi.org/10.1016/J.JNONCRYSOL.2006.09.02010.1016/J.JNONCRYSOL.2006.09.020 ↗
61. Antyushin VF, Sysoev BI, Synorov VF (1979) Identification of alkali metal ions in silicon dioxide films. Phys Status Solidi 56:K91–K95. https://doi.org/10.1002/pssa.221056025010.1002/pssa.2210560250 ↗
62. Ristić GS, Vasović ND, Kovačević M, Jakšić AB (2011) The sensitivity of 100 nm RADFETs with zero gate bias up to dose of 230 Gy(Si). Nucl Instrum Methods Phys Res Sect B Beam Interact Mater Atoms 269:2703–2708. https://doi.org/10.1016/j.nimb.2011.08.01510.1016/j.nimb.2011.08.015 ↗
63. Kahraman A, Yilmaz E, Aktag A, Kaya S (2016) Evaluation of radiation sensor aspects of Er2O3 MOS capacitors under zero gate bias. IEEE Trans Nucl Sci 63:1284–1293. https://doi.org/10.1109/TNS.2016.252462510.1109/TNS.2016.2524625 ↗
64. Bibilashvili A, Kushitashvili Z (2016) C–V measurement of HfO2 dielectric layer received by UV stimulated plasma anodizing. IOP Conf Ser Earth Environ Sci 44:052008. https://doi.org/10.1088/1755-1315/44/5/05200810.1088/1755-1315/44/5/052008 ↗
65. Brillson LJ (2010) Surfaces and interfaces of electronic materials. Wiley, Columbus10.1002/9783527665709 ↗
66. Lannoo M (1990) The role of dangling bonds in the properties of surfaces and interfaces of semiconductors. Rev Phys Appl 25:887–894. https://doi.org/10.1051/rphysap:0199000250908870010.1051/rphysap:01990002509088700 ↗
67. Breeden M, Wolf S, Ueda S, Fang Z, Chang C-Y, Tang K, McIntyre P, Kummel AC (2019) Al2O3/Si0.7Ge0.3(001) & HfO2/Si0.7Ge0.3(001) interface trap state reduction via in situ N2/H2 RF downstream plasma passivation. Appl Surf Sci 478:1065–1073. https://doi.org/10.1016/j.apsusc.2019.01.21610.1016/j.apsusc.2019.01.216 ↗
68. Kooi E (1967) The surface properties of oxidized silicon. Springer, New York10.1007/978-3-662-40210-8 ↗
69. Kim MS, Kim HT, Chi SS, Kim TE, Shin HT, Kang KW, Park HS, Kim DJ, Min KS, Kang DW, Kim DM (2003) Distribution of interface states in MOS systems extracted by the subthreshold current in MOSFETs under optical illumination. J Korean Phys Soc 43:873–878. https://doi.org/10.3938/jkps.43.87310.3938/jkps.43.873 ↗
70. McWhorter PJ, Winokur PS, Pastorek RA (1988) Donor/acceptor nature of radiation-induced interface traps. IEEE Trans Nucl Sci 35:1154–1159. https://doi.org/10.1109/23.2543310.1109/23.25433 ↗
71. Kaya S, Yilmaz E (2015) A comprehensive study on the frequency-dependent electrical characteristics of Sm2O3 MOS capacitors. IEEE Trans Electron Devices 62:980–987. https://doi.org/10.1109/TED.2015.238995310.1109/TED.2015.2389953 ↗
72. Kahraman A, Gurer U, Lok R, Kaya S, Yilmaz E (2018) Impact of interfacial layer using ultra-thin SiO2 on electrical and structural characteristics of Gd2O3 MOS capacitor. J Mater Sci Mater Electron 29:17473–17482. https://doi.org/10.1007/s10854-018-9847-910.1007/s10854-018-9847-9 ↗
73. Kahraman A, Yilmaz E, Kaya S, Aktag A (2015) Effects of post deposition annealing, interface states and series resistance on electrical characteristics of HfO2 MOS capacitors. J Mater Sci Mater Electron 26:8277–8284. https://doi.org/10.1007/s10854-015-3492-310.1007/s10854-015-3492-3 ↗
74. Nicollian E, Brews J (1982) MOS (metal oxide semiconductor) physics and technology. Wiley-Interscience, New York
75. Kwa KSK, Chattopadhyay S, Jankovic ND, Olsen SH, Driscoll LS, Neill AGO (2003) A model for capacitance reconstruction from measured lossy MOS capacitance voltage characteristics. Semicond Sci Technol 18:82–87. https://doi.org/10.1088/0268-1242/18/2/30310.1088/0268-1242/18/2/303 ↗
76. Oh T-Y, Yu Z, Dutton RW (2002) AC analysis of thin gate oxide MOS with quantum mechanical corrections. In: IEEE proceedings international symposium on quality electronic design. IEEE Comput. Soc, pp 326–330. https://doi.org/10.1109/isqed.2002.99676710.1109/isqed.2002.996767 ↗
77. Kahraman A, Yilmaz E (2017) Proposal of alternative sensitive region for MOS based radiation sensors: Yb2O3. J Vac Sci Technol A Vac Surf Film 35:061511. https://doi.org/10.1116/1.499354510.1116/1.4993545 ↗
78. Xiao H, Huang S (2010) Frequency and voltage dependency of interface states and series resistance in Al/SiO2/p-Si MOS structure. Mater Sci Semicond Process 13:395–399. https://doi.org/10.1016/J.MSSP.2011.05.00910.1016/J.MSSP.2011.05.009 ↗
79. Altuntas H, Kaplan K (2018) Electrical conduction mechanisms and dielectric relaxation in Al2O3 thin films deposited by thermal atomic layer deposition. Mater Sci Semicond Process 86:111–114. https://doi.org/10.1016/J.MSSP.2018.06.02710.1016/J.MSSP.2018.06.027 ↗
80. Bülbül MM, Altındal Ş, Parlaktürk F, Tataroğlu A (2011) The density of interface states and their relaxation times in Au/Bi4Ti3O12/SiO2/n-Si(MFIS) structures. Surf Interface Anal 43:1561–1565. https://doi.org/10.1002/sia.374910.1002/sia.3749 ↗
81. Khosla R, Kumar P, Sharma SK (2015) Charge trapping and decay mechanism in post deposition annealed Er2O3 MOS capacitors by nanoscopic and macroscopic characterization. IEEE Trans Device Mater Reliab 15:610–616. https://doi.org/10.1109/TDMR.2015.249831010.1109/TDMR.2015.2498310 ↗
82. Hill WA, Coleman CC (1980) A single-frequency approximation for interface-state density determination. Solid State Electron 23:987–993. https://doi.org/10.1016/0038-1101(80)90064-710.1016/0038-1101(80)90064-7 ↗
83. Kahraman A, Yilmaz E (2017) Irradiation response of radio-frequency sputtered Al/Gd2O3/p-Si MOS capacitors. Radiat Phys Chem 139:114–119. https://doi.org/10.1016/J.RADPHYSCHEM.2017.04.00310.1016/J.RADPHYSCHEM.2017.04.003 ↗
84. Kahraman A, Yilmaz E (2018) A comprehensive study on usage of Gd2O3 dielectric in MOS based radiation sensors considering frequency dependent radiation response. Radiat Phys Chem 152:36–42. https://doi.org/10.1016/J.RADPHYSCHEM.2018.07.01710.1016/J.RADPHYSCHEM.2018.07.017 ↗
85. Ferrari S, Modreanu M, Scarel G, Fanciulli M (2004) X-Ray reflectivity and spectroscopic ellipsometry as metrology tools for the characterization of interfacial layers in high-k materials. Thin Solid Films 450:124–127. https://doi.org/10.1016/J.TSF.2003.10.05110.1016/J.TSF.2003.10.051 ↗
86. Bharathi KK, Kalidindi NR, Ramana CV (2010) Grain size and strain effects on the optical and electrical properties of hafnium oxide nanocrystalline thin films. J Appl Phys 108:83529. https://doi.org/10.1063/1.349932510.1063/1.3499325 ↗
87. Yang S-D, Zheng Y-X, Yang L, Liu Z-H, Zhou W-J, Wang S-Y, Zhang R-J, Chen L-Y (2017) Structural and optical properties of highly (110)-oriented non-polar ZnO evaporated films on Si substrates. Appl Surf Sci 421:891–898. https://doi.org/10.1016/J.APSUSC.2017.02.06910.1016/J.APSUSC.2017.02.069 ↗
88. Langford JI, Wilson AJC (1978) Scherrer after sixty years: a survey and some new results in the determination of crystallite size. J Appl Crystallogr 11:102–113. https://doi.org/10.1107/S002188987801284410.1107/S0021889878012844 ↗
89. Kaya S, Yilmaz E (2018) Modifications of structural, chemical, and electrical characteristics of Er2O3/Si interface under Co-60 gamma irradiation. Nucl Instrum Methods Phys Res Sect B Beam Interact Mater Atoms 418:74–79. https://doi.org/10.1016/j.nimb.2018.01.01010.1016/j.nimb.2018.01.010 ↗
90. Kao C-H, Chen H, Pan YT, Chiu JS, Lu T-C (2012) The characteristics of the high-K Er2O3 (erbium oxide) dielectrics deposited on polycrystalline silicon. Solid State Commun 152:504–508. https://doi.org/10.1016/J.SSC.2011.12.04210.1016/J.SSC.2011.12.042 ↗
91. Xu K, Dang V-S, Ney A, de los Arcos T, Devil A (2014) Nanostructured Er2O3 thin films grown by metalorganic chemical vapour deposition. J Nanosci Nanotechnol 14:5095–510210.1166/jnn.2014.8848 ↗
92. Mishra M, Kuppusami P, Ramya S, Ganesan V, Singh A, Thirumurugesan R, Mohandas E (2015) Microstructure and optical properties of Gd2O3 thin films prepared by pulsed laser deposition. Surf Coat Technol 262:56–63. https://doi.org/10.1016/J.SURFCOAT.2014.12.01210.1016/J.SURFCOAT.2014.12.012 ↗
93. Ho M-Y, Gong H, Wilk GD, Busch BW, Green ML, Voyles PM, Muller DA, Bude M, Lin WH, See A, Loomans ME, Lahiri SK, Räisänen PI (2003) Morphology and crystallization kinetics in HfO2 thin films grown by atomic layer deposition. J Appl Phys. https://doi.org/10.1063/1.153438110.1063/1.1534381 ↗
94. Molle A, Wiemer C, Bhuiyan MNK, Tallarida G, Fanciulli M, Pavia G (2007) Cubic-to-monoclinic phase transition during the epitaxial growth of crystalline Gd2O3 films on Ge(001) substrates. Appl Phys Lett 90:193511. https://doi.org/10.1063/1.273836710.1063/1.2738367 ↗
95. Zhao C, Zhao CZ, Werner M, Taylor S, Chalker PR (2012) Advanced CMOS gate stack: present research progress. ISRN Nanotechnol 2012:1–35. https://doi.org/10.5402/2012/68902310.5402/2012/689023 ↗
96. Singh MP, Thakur CS, Shalini K, Banerjee S, Bhat N, Shivashankar SA (2004) Structural, optical, and electrical characterization of gadolinium oxide films deposited by low-pressure metalorganic chemical vapor deposition. J Appl Phys 96:5631–5637. https://doi.org/10.1063/1.180115710.1063/1.1801157 ↗
97. Zhang L, Liu M, Ren W, Zhou Z, Dong G, Zhang Y, Peng B, Hao X, Wang C, Jiang Z-D, Jing W, Ye Z-G (2017) ALD preparation of high-k HfO2 thin films with enhanced energy density and efficient electrostatic energy storage. R Soc Chem. https://doi.org/10.1039/c6ra27847g10.1039/c6ra27847g ↗
98. Lin Y-S, Puthenkovilakam R, Chang JP (2002) Dielectric property and thermal stability of HfO2 on silicon. Appl Phys Lett 81:2041–2043. https://doi.org/10.1063/1.150620710.1063/1.1506207 ↗
99. Jones MN, Kwon YW, Norton DP (2005) Dielectric constant and current transport for HfO2 thin films on ITO. Appl Phys A 81(81):285–288. https://doi.org/10.1007/s00339-005-3208-210.1007/s00339-005-3208-2 ↗
100. Khairnar AG, Mahajan AM (2013) Effect of post-deposition annealing temperature on RF-sputtered HfO2 thin film for advanced CMOS technology. Solid State Sci 15:24–28. https://doi.org/10.1016/J.SOLIDSTATESCIENCES.2012.09.01010.1016/J.SOLIDSTATESCIENCES.2012.09.010 ↗